Archives: News
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STMicroelectronics Joins Startup Autobahn as Anchor Partner to Meet Tomorrow’s Automotive Innovators
Startup Autobahn program connects new companies with major brands for investment and development ST is first semiconductor manufacturer to become Anchor Partner Geneva, Switzerland, July…
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Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters
CHANDLER, Ariz., July 21, 2021 (GLOBE NEWSWIRE) — Cloud service providers and server original equipment manufacturers (OEMs) designing storage platforms demand exceptional performance, flexibility and…
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Smart Eye and OmniVision Announce End-to-End Interior Sensing Solution
GOTHENBURG, Sweden–(BUSINESS WIRE)–Smart Eye AB, a global leader in interior sensing AI, and OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, jointly…
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Vecow Launches EAC-2000 Series NVIDIA Jetson Xavier Fanless Embedded System
New Taipei City, Taiwan, July 20, 2021 – Vecow Co., Ltd., a team of global embedded experts, announced the latest Fanless Embedded System EAC-2000 Series. Powered…
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CrossBar Announces New ReRAM Application for Hardware Security and Secure Computing
Santa Clara, CA – July 20, 2021 – CrossBar Inc., the leading ReRAM technology leader, today announced a new application of its Resistive RAM (ReRAM) technology for…
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GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
SAN JOSE, Calif. and GUANGZHOU, China, July 20, 2021 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, introduces their ISP (Image…
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New HES Board is Ideal for Prototyping and Emulating Medium to Large ASIC & SoC Designs
Henderson, NV, USA – July 19, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the…
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New Ethernet PHYs Enable Multidrop Bus Architecture, Enhancing Industrial Networks’ Scalability and Functionality
CHANDLER, Ariz., July 20, 2021 (GLOBE NEWSWIRE) — Smart manufacturing is driving efficiencies in automation as digital networks increasingly connect machines, production line equipment and…
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TDK offers high-current and low-inductance power inductors for automotive power circuits
July 20, 2021 TDK Corporation (TSE: 6762) developed new HPL505032F1 power inductors for use in automotive circuits. The inductors enable level 5 ADAS applications for…
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ADLINK Joins the O-RAN ALLIANCE to Accelerate Network Interoperability and Enterprise Migration to 5G
Summary: ● ADLINK joins the O-RAN ALLIANCE as a Contributor member to facilitate technology innovation for 5G Radio Access Networks (RAN), and the integration of…