News – Page 663 – EEJournal

SEGGER and Analog Devices Collaboration Delivers Communication Solution for Industrial Ethernet-APL

Monheim am Rhein, Germany – 12th July 2021 SEGGER Microcontroller GmbH, a leading provider of development tools and software for embedded systems, today announced a…

July 12, 2021

Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension

Oxford, United Kingdom, July 12th, 2021 — Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced that Andes Technology Corp., a…

July 12, 2021

Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment

July 12, 2021 – Mouser Electronics Inc. today releases the third installment of the 2021 series of its award-winning Empowering Innovation Together™ program. The series’ third installment dives deep into…

July 12, 2021

Isolated Buck Converters from STMicroelectronics Reduce Bill-of-Materials Costs in Automotive and Industrial Applications

Geneva, July 8, 2021 – Optimized for isolated buck regulator designs, the STMicroelectronics A6986I and L6986I DC/DC converter ICs have a wide input-voltage range and low quiescent current to ensure robust…

July 12, 2021

3D Stacking Paves Way for Smaller, Power-Packed Computing Chips

SINGAPORE, 09 July 2021 – Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that…

July 12, 2021

Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

TAICHUNG, Taiwan and YOKOHAMA, Japan– 2021-07-08 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM™ and…

July 12, 2021

Archives: News

SEGGER and Analog Devices Collaboration Delivers Communication Solution for Industrial Ethernet-APL

Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension

Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment

Isolated Buck Converters from STMicroelectronics Reduce Bill-of-Materials Costs in Automotive and Industrial Applications

3D Stacking Paves Way for Smaller, Power-Packed Computing Chips

Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment

OKdo launches fast online PCB manufacturing service

Sensata Technologies’ Power Disconnect Solution Enables Faster and Safer DC Fast Charging

Vecow Launches VAC-1000 Arm-based Edge AI Computing System