Archives: News
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Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Testing
TOKYO, Japan, June 17, 2021 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) is pilot testing a next-generation solution for performing…
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Applied Materials Breakthrough in Chip Wiring Enables Logic Scaling to 3nm and Beyond
Integrating seven process technologies in one system under vacuum cuts interconnect resistance in half New materials engineering approaches increase chip performance and reduce power consumption…
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Siemens announces new JEDEC industry standard for electronics cooling simulation
Siemens Digital Industries Software today announced the establishment of JEP181—a neutral file, XML-based standard from the JEDEC Solid State Technology Association, which is the global…