News – Page 682 – EEJournal

Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

SAN JOSE, Calif., May 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is expanding its collaboration with TSMC to accelerate mobile, AI…

May 28, 2021

Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC’s N3 Process Technology

MOUNTAIN VIEW, Calif., May 27, 2021 /PRNewswire/ — Highlights for this Announcement: DesignWare PVT monitoring and sensing subsystem IP supports cutting-edge technologies targeting AI, data center, HPC,…

May 27, 2021

New eBook from CUI Devices Offers a Complete Guide to Thermal Management

LAKE OSWEGO, Ore. — May 27, 2021 — CUI Devices’ Thermal Management Group today announced the release of a free, comprehensive ebook on the topic…

May 27, 2021

iWave Unveils the Implementation of ARINC 818-2 IP Core On Microsemi PolarFire FPGA

The ARINC 818 video protocol since its inception has gained wide adoption on large aircrafts such as Airbus A350XWB, Boeing 787, KC46A, and many others.…

May 27, 2021

Newark now stocks OrangeCrab open-source FPGA development board

Chicago – May 25, 2021: Newark, an Avnet Company and global distributor of electronic components, products and solutions, has expanded its range of single board computer (SBC) development…

May 27, 2021

ACEINNA Announces OpenIMU335RI, Next Generation High Performance Inertial Measurement Unit

Andover, Massachusetts- May 26, 2021 ACEINNA Inc. (pronounced “A See Nah”), today announced the general availability of the OpenIMU335RI, a rugged inertial measurement unit (IMU) with…

May 27, 2021

Renesas Launches LTE CAT-M1 Module For Massive IoT Based On Carrier-Proven Monarch Technology From Sequans

Düsseldorf, May 26, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RYZ014A, Renesas’ first cellular IoT module supporting the LTE…

May 27, 2021

LoRa Alliance® Achieves Goals to Drive Scale of LoRaWAN® for Massive IoT

FREMONT, Calif., May 26, 2021 (GLOBE NEWSWIRE) — The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for the Internet of Things (IoT) low-power…

May 27, 2021

KEMET Introduces High Temperature, Power DC-Link Film Capacitor for Extended Lifetime Requirements in Automotive and Green Energy Applications

KEMET, part of the YAGEO Group and leading global electronic components supplier, announces its new C4AK high temperature, power film DC-Link capacitor designed for continuous…

May 27, 2021

Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices

HILLSBORO, OR – May 26, 2021 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced enhancements to its award-winning Lattice sensAI™ solution stack for accelerating AI/ML application…

May 26, 2021

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