News – Page 688 – EEJournal

VIAVI Introduces 800G FLEX XPM Module As Communication, Cloud and Hyperscale Service Providers Accelerate High-Speed Adoption

Scottsdale, Ariz., May 17, 2021 – Viavi Solutions Inc. (VIAVI) (NASDAQ: VIAV) today announced the expansion of the VIAVI ONT solution portfolio with the 800G FLEX XPM Module, the industry’s first…

May 17, 2021

SEGGER Introduces Flasher PRO XL — The Almost-Anything-Programmer with Extra-Large Memory

Monheim am Rhein, Germany – 17th May 2021 The SEGGER Flasher PRO XL is a full-featured, in-circuit, universal flash programming tool with extra-large memory capacity.…

May 17, 2021

Akoustis Secures WiFi 6E Reference Design with Third SoC Maker

Charlotte, N.C., May 17, 2021 (GLOBE NEWSWIRE) — Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk…

May 17, 2021

Vishay Intertechnology High Precision Thin Film Wraparound Chip Resistor Delivers Tight TCR of ± 2 ppm/°C Over 100 Ω to 3.05 MΩ Resistance Range

MALVERN, Pa. — May 17, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new high precision thin film wraparound chip resistor for industrial, medical,…

May 17, 2021

Archives: News

VIAVI Introduces 800G FLEX XPM Module As Communication, Cloud and Hyperscale Service Providers Accelerate High-Speed Adoption

SEGGER Introduces Flasher PRO XL — The Almost-Anything-Programmer with Extra-Large Memory

Akoustis Secures WiFi 6E Reference Design with Third SoC Maker

Vishay Intertechnology High Precision Thin Film Wraparound Chip Resistor Delivers Tight TCR of ± 2 ppm/°C Over 100 Ω to 3.05 MΩ Resistance Range

GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products

Oxford Instruments Demonstrate the Capabilities of Paragraf Graphene Hall Effect Sensors Under Extreme Conditions

Multi-Function SOSA-Aligned RFSoC Board Combines Analog & Digital Capability

Transtector Releases AC Fused Disconnect for Effective Small Cell Power Management

New PFS1200 Series Targets Ultra-compact Front-End Applications

congatec presents artificial intelligence platforms for medical equipment market