News – Page 717 – EEJournal

ADLINK Launches Compact SMARC AI-on-Module to Drive Industrial AI at the Edge

● The LEC-IMX8MP SMARC AI-on-module features NXP’s i.MX 8M Plus with integrated NPU running up to 2.3 TOPS ● Integrates NXP NPU, VPU and GPU…

March 18, 2021

Druck Unveils revolutionary new Pressure Control Module and the next generation in Pressure Sensors

Pressure measurement company launches the world’s fastest pressure controller, PACE CM3 Druck also launches ADROIT6000 pressure sensor, providing advanced levels of accuracy and reliability across…

March 18, 2021

Dialog Semiconductor Adds Multi-Channel Input Capability to New Nanoamp GreenPAK™ Device

London, United Kingdom – March 15, 2021 – Dialog Semiconductor plc (XETRA:DLG), a leading provider of battery and power management, Wi-Fi®, Bluetooth® low energy, and Industrial edge…

March 18, 2021

New Power Over Ethernet Magnetic Modules Support Higher Power, Extended Bandwidth Applications

Santa Clara, CA [March 16, 2021] Bel Power Solutions, a Bel group company introduces 100W 4-pair, Power over Ethernet, NBASE-T / 802.3bz Magnetic Modules. The 100W…

March 18, 2021

Siemens’ Veloce Virtual Network App Certified for IxVerify 3.0

Siemens Digital Industries Software today announced that its Veloce™ Network (VN) App is now certified for use with the Keysight IxVerify 3.0 software pre-silicon test solution. Siemens’…

March 18, 2021

Mouser and Molex Sponsor Dale Coyne Racing with Vasser Sullivan for 2021 IndyCar Season

March 17, 2021 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is happy to once again sponsor the Dale Coyne Racing…

March 18, 2021

Siemens and Digital Charging Solutions make it easier for companies to switch to zero-emission fleets

Siemens Smart Infrastructure and Digital Charging Solutions have started cooperation A jointly developed service offers corporate customers access to over 190,000 public charging points in…

March 18, 2021

eSync™ Alliance announces v2.0 specification for automotive OTA updates and data gathering

Silicon Valley, CA, March 17, 2021 – The eSync™ Alliance announces that it has released v2.0 of the eSync specification. The new release expands on data…

March 18, 2021

X-FAB Enters into Collaboration with IHP to Progress SiGe BiCMOS Technology

Tessenderlo, Belgium and Frankfurt/Oder, Germany – March 17, 2021 X-FAB Silicon Foundries and IHP – Leibniz Institute for High Performance Microelectronics have announced a major…

March 17, 2021

Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis

Highlights: Sigrity X delivers up to 10X performance improvement with uncompromised accuracy Breakthrough massively distributed simulation enables large-scale complex analysis in the cloud Tightly integrated,…

March 17, 2021

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