News – Page 817 – EEJournal

Festo Lowers Wafer Oxidation Risk with New N2 Purge System

SLANDIA, NY, July 14, 2020 — The new Festo N2 purge system for silicon wafer manufacture significantly reduces the risk of oxidation caused by particle contamination. This Festo system…

July 16, 2020

Keysight Technologies Joins Ericsson Industry 4.0 Partner Program for System Integrators

SANTA ROSA, Calif., July 15, 2020 – Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation…

July 16, 2020

Vuzix Highlights its Growing Augmented Reality Smart Glasses Patent Portfolio for Next Generation Smart Glasses

Vuzix waveguides with holographic optics, laser and micro LED display integration cornerstone to producing fashion forward wearable computer smart glasses Company’s patent portfolio has grown…

July 16, 2020

SWAN Forum and LoRa Alliance® Enter Liaison Agreement to Drive Expanded Network Coverage and IoT Adoption in Water Sector

Surrey, UK – July 15, 2020 – The Smart Water Networks Forum (SWAN) has formed a new strategic liaison with the LoRa Alliance® to advance “smart,” data-driven…

July 15, 2020

RS Components reveals the winners of its STEM Extraordinary Engineering Challenge

LONDON, UK, 15 July 2020 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel solutions partner for industrial customers…

July 15, 2020

Newark launches new eBook: “The era of AIoT, Context, Capabilities and Future of AIoT”

Artificial Intelligence (AI) and Internet of Things (IoT) are changing the nature of work across the globe. AI is not a new concept, what began in…

July 15, 2020

ROHM’s Blue-Green Chip LEDs Ideal for Color Universal Design Applications

Kyoto, Japan and Santa Clara, CA, July 15, 2020 (GLOBE NEWSWIRE) — ROHM recently announced the1608-size high accuracy blue-green chip LEDs, SMLD12E2N1W and SMLD12E3N1W. These products support the adoption of Color…

July 15, 2020

Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys’ Broad DesignWare IP Portfolio

MOUNTAIN VIEW, Calif., July 15, 2020 /PRNewswire/ — Highlights: Tenstorrent achieved first-pass silicon success for its Grayskull AI processor SoC using DesignWare PCI Express 4.0, ARC HS48…

July 15, 2020

TDK SmartBug™, intelligent multi-sensor IoT module, now available worldwide

SmartBug™ combines TDK’s high-performance MEMS sensors and precision algorithms in a simple all-in-one wireless solution Designed as a dedicated source of smart sensor data for…

July 15, 2020

Vishay Intertechnology Now Listed as Approved Source for DLA Drawing 20001 Wet Tantalum Capacitors

MALVERN, Pa. — July 14, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that its tantalum capacitors division is now an approved source for DLA drawing…

July 15, 2020

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