Archives: News
-
Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud
MOUNTAIN VIEW, Calif., June 15, 2020 — Highlights: Significant throughput gains with PrimeTime timing signoff and StarRC extraction for multi-scenario, distributed processing runs Considerable cost savings…
-
ProTek Devices’ Intros Hybrid Semiconductor for AC Power Circuit Protection
TEMPE, Ariz. – June 15, 2020 – ProTek Devices has introduced a new patent-pending series of hybrid semiconductor components for AC power supply circuit protection…
-
Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
Highlights: -Collaboration provides an accelerated path for customers to complete timing signoff by adopting Cadence signoff solutions using TSMC technology on the Microsoft Azure cloud…
-
Ansys and Electro Magnetic Applications Partner to Deliver Design-to-Validation Workflow for Cable Harnesses
PITTSBURGH, June 11, 2020 – Electro Magnetic Applications, Inc. (EMA) and Ansys (NASDAQ: ANSS) are partnering to deliver an enhanced design-to-validation workflow for certifying cable harness models in aircraft and automobiles.…