Archives: News
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New York Institute of Technology -Vancouver Develops Secure Boot Application for GOWIN SecureFPGA
SAN JOSE, Calif. and GUANGZHOU, China, April 21, 2020 (GLOBE NEWSWIRE) — GOWIN Semiconductor announced their SecureFPGA devices in 2019 which enable hardware PUF (Physically…
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PCIe 4.0 Mux/DeMux ReDrivers From Diodes Incorporated Address Challenges of Routing High-Speed Serial Bus Signals
Plano, Texas – April 21, 2020 – Diodes Incorporated (Nasdaq: DIOD) today announced the PI3EQX16612 and PI3EQX16621 PCI Express® compliant ReDriverâ„¢ devices offering four differential channels with either 1:2 (demultiplexing) or…
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Microchip Releases Version 2.1 of TimeProviderÃ’ 4100 Timing Grandmaster
CHANDLER, Ariz., April 21, 2020 – To help 5G mobile providers, cable operators and utility providers ensure phase delivery, protection and synchronization even when the Global Navigation …
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Imperas Leading RISC-V CPU Reference Model for Hardware Design Verification Selected by Mellanox
Oxford, United Kingdom, April 21st, 2020 — Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced that Mellanox Technologies, a…
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OnAsset Intelligence Successfully Conducts World’s Largest Industrial Bluetooth® Density Test
IRVING, Texas – April 21, 2020 – OnAsset Intelligence, the leading provider of supply chain tracking and monitoring solutions, has successfully proven that Bluetooth Low…
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ON Semiconductor Unveils New QCS-AX2 Series for Wi-Fi 6E Applications
PHOENIX, Ariz. – Apr. 21, 2020 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, announced sampling of its new QCS-AX2 chipset family that supports…
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Keysight’s 5G Solutions Enable Hisense Communication to Accelerate Development of High-Quality 5G Devices
SANTA ROSA, Calif., April 21, 2020 – Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation…
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Fujitsu Develops Easy to Handle, Flexible Nanotube Adhesive Sheet Technology with High Thermal Conductivity
KAWASAKI, Japan, Apr 17, 2020Â –Â (JCN Newswire)Â –Â Fujitsu Laboratories Ltd. today announced the development of the world’s first adhesive sheet composed of carbon nanotubes with extremely high…
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Uhnder and dSPACE Establish Cooperation for Radar Technology Development
Detroit / Austin, April 16, 2020. As radar systems are a key technology for automated and autonomous driving, Uhnder and dSPACE have agreed to cooperate…
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Keysight, DEKRA Join Forces to Address Growing Electric Vehicle Market
SANTA ROSA, Calif., April 16, 2020 Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to…