Archives: News
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Evonetix collaborate with imec to scale-up chip-based technology production for third generation DNA synthesis platform
CAMBRIDGE (UK), and LEUVEN (Belgium), January 13, 2020 – EVONETIX LTD (‘Evonetix’), the synthetic biology company developing a desktop platform for scalable, high-fidelity and rapid…
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Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs
Successful 7nm designs with Cadence digital technology lead to broader collaboration Cadence digital implementation solutions and technology leadership drive expanded usage on 5/7nm designs SAN…
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Green Hills Software and StradVision Demonstrate Road-Ready Deep Learning Perception at CES 2020
SANTA BARBARA, Calif., and SAN JOSE, Calif. (Jan. 9, 2020) — When the biggest stakeholders in the automotive and technology worlds converge in Las Vegas at CES 2020 from Jan.…
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New RX310 Rugged SDR from Pixus Features TwinRX Option
Waterloo, Ontario — Jan 09, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has developed ruggedized versions of commercial software defined radios. The latest…
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VadaTech Announces 1,344Gb/s Fiber FMC+ Module
Henderson, NV – January 13, 2020 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the FMC259. The FMC259…
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EM Microelectronic enables holistic omnichannel consumer experience and product authentication
Marin, Switzerland, 10 January 2020 – EM Microelectronic, the ultra-low-power semiconductor company of the Swatch Group and an RFID industry pioneer for more than 30 years,…
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Simplifying and accelerating automotive system design: A new collaboration between Arm and Siemens
The automotive industry has entered an intense period of innovation, powered by advances in semiconductor, electronic and software technologies. These emerging technologies will enable a…
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TE Connectivity releases MS5839-02BA, an ultra-compact, harsh media resistant digital pressure and temperature sensor
DORTMUND, Germany – Jan. 13, 2020 – Miniaturization, performance and precision are key for sensors embedded in consumer devices like swim watches and diving equipment,…
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D3 Engineering Announces a DesignCore® Development Kit Designed Around the TDA4VM SoC Processor from Texas Instruments
Rochester, NY – January 8, 2020 – D3 Engineering, a Texas Instruments platinum design partner, announced their DesignCore® RVP-TDA4Vx Development Kit with rugged ECU. The DesignCore®…
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Mouser and Grant Imahara Showcase Contract Manufacturing in “Engineering Big Ideas” Video Finale
January 13, 2020 – Mouser Electronics, Inc. and celebrity engineer Grant Imahara today released the final Engineering Big Ideas video, the latest series in Mouser’s award-winning Empowering Innovation Together™…