News – Page 887 – EEJournal

NVIDIA Turing GPUs and NVIDIA Xavier Achieve Fastest Results on MLPerf Benchmarks Measuring Data Center and Edge AI Inference Performance

NVIDIA today posted the fastest results on new benchmarks measuring the performance of AI inference workloads in data centers and at the edge — building…

November 18, 2019

Temperature Sensor Accurate to 0.25°C, from STMicroelectronics, Delivers Flexible Power Savings for Mobile Monitoring

Geneva, November 18, 2019 — With typical temperature-reading accuracy of 0.25°C and low operating and standby current, the STMicroelectronics STTS22H enhances temperature and heat-flow monitoring in asset trackers,…

November 18, 2019

Supplyframe and Cadence collaborate to integrate cloud-based PCB library service directly with the next generation of PCB tools

Pasadena, CA, USA, November 18th, 2019 – Supplyframe’s subsidiary company SamacSys, the world’s leading provider of electronic component CAD models and library services, has completed…

November 18, 2019

New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging

Silicon proven and prime for customer engagements today Supports multi-chip module SoCs on organic substrates 40Gbps wire speed delivers up to 1Tbps/mm unidirectional bandwidth Achieves…

November 14, 2019

Archives: News

NVIDIA Turing GPUs and NVIDIA Xavier Achieve Fastest Results on MLPerf Benchmarks Measuring Data Center and Edge AI Inference Performance

Temperature Sensor Accurate to 0.25°C, from STMicroelectronics, Delivers Flexible Power Savings for Mobile Monitoring

Supplyframe and Cadence collaborate to integrate cloud-based PCB library service directly with the next generation of PCB tools

Pentek Announces 6.4 GHz A/D and D/A Jade 3U VPX Module for Wideband Defense, Radar and Communication Applications

Vishay Intertechnology AC and Pulse Film Capacitors Ensure Compliance With AEC-Q200 Rev. D, Withstand THB Testing

Samtec and REFLEX CES Launch New 448 Gbps (16 x 28 Gbps) Embedded Optical Development Platform at SC19

Blaize Emerges from Stealth to Transform AI Computing

Nordic Semiconductor unveils world’s first dual Arm Cortex-M33 processor wireless SoC

Keysight, FormFactor and CompoundTek Join Forces to Accelerate Integrated Photonics Innovations

New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging