Archives: News
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OnScale and SoftMEMS Collaborate with Mentor to Announce a New Integrated Workflow for MEMS Digital Prototyping
SAN DIEGO, Oct. 23, 2019 /PRNewswire/ — Today, at the MEMS & Sensors Executive Congress – MSEC 2019, OnScale® and SoftMEMS® announced the first truly integrated workflow…
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STMicroelectronics Unleashes Enhanced NFC Experiences of New iOS 13 Platform
New iOS 13 release to significantly extend support for NFC applications including reading/writing tags and improved user experience ST provides support for developers to…
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Synopsys Launches New ARC VPX DSP Processor IP for High-performance Signal Processing SoC Designs
MOUNTAIN VIEW, Calif., Oct. 22, 2019 /PRNewswire/ — Highlights: Synopsys ARC VPX5 and VPX5FS DSP Processors are based on an extended instruction set and VLIW/SIMD architecture optimized…
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Samtec Features Latest 32 GT/s Interconnect Solutions at PCI-SIG® Developers Conference Asia-Pacific Tour 2019
New Albany, IN:Â Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest…
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Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing
SAN JOSE, Calif., October 22, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry’s first Verification IP (VIP) in support of…
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X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform
Tessenderlo, Belgium – October 17, 2019 X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, today announced the availability of SONOS-based Flash and embedded…