News – Page 906 – EEJournal

SmartDV Announces Availability of Ethernet TSN Design IP

SAN JOSE, CALIF –– September 17, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Design and Verification Intellectual Property (IP), today announced its…

September 19, 2019

Sensera Partners with Autodesk to Exhibit 3D IoT Positioning Solution

Autodesk selects Sensera to demonstrate its real-time 3D location services and smart sensor visualization at Autodesk’s Boston Technology Center as part of its Residency…

September 19, 2019

Renesas Electronics Showcases Latest Optical Communication Solutions at ECOC 2019

Düsseldorf, September 17, 2019 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced it will highlight its newest technologies for data…

September 19, 2019

Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis

SAN JOSE, Calif., 17 Sep 2019 Massively parallel execution delivers up to 10X faster performance than existing solutions without compromising accuracy Transient as well as…

September 18, 2019

D2S Enables “Stitchless” Full-Chip Inverse Lithography Technology in a Single Day for The Multi-Beam Era

D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today introduced TrueMask® ILT, a GPU-accelerated hardware and software system that enables IC manufacturers to implement stitchless, full-chip…

September 18, 2019

congatec launches 100 Watt ecosystem for embedded edge and micro servers

San Diego, CA, 17 September 2019 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – launches its…

September 18, 2019

OmniVision’s Automotive SoC Offers Rear and Surround View Cameras Industry’s Best Low-Light Performance, Lowest Power and Smallest Size

SANTA CLARA, Calif. – Sept. 17, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced from the AutoSens conference its 1.3MP OX01F10 SoC, providing automotive designers with the industry’s best imaging performance across…

September 18, 2019

Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications

Mountain View, California, and Munich, Germany – 17 September 2019 – Artificial intelligence (AI) and neural networks are becoming a key factor in developing safer,…

September 18, 2019

Wind River Helix Virtualization Platform Conformant to Latest FACE Technical Standard, Edition 3.0 Safety Base and Security Profiles

DAYTON, OH and ALAMEDA, CA Sept. 17, 2019 Wind River®, a leader in delivering software to critical infrastructure, today announced that Wind River…

September 18, 2019

Synopsys Announces New Release of LucidShape Software for Automotive Lighting Design and Analysis

MOUNTAIN VIEW, Calif., Sept. 17, 2019 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced the latest release of its LucidShape® software for the design, simulation, and analysis of automotive exterior lighting products. LucidShape…

September 18, 2019

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