Archives: News
-
Accellera Announces Proposed Working Group to Standardize UVM Analog/Mixed-Signal Extensions
Elk Grove, Calif., April 24, 2019 — Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA)…
-
RS Components introduces new easy-to-connect cloud IoT development board from Microchip
LONDON, UK, 24 April 2019 – RS Components (https://uk.rs-online.com/web/) (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and…
-
Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design
SAN JOSE, Calif., 22 Apr 2019 Highlights: Cadence digital, signoff and custom/analog tools achieve latest DRM and SPICE certifications, and Cadence IP is enabled for…
-
Synopsys Design Platform Certified for TSMC’s Innovative SoIC Chip Stacking Technology
MOUNTAIN VIEW, Calif., April 23, 2019 /PRNewswire/ — Highlights: Efficient support for the new chip stacking technology ensures realization of highest-performing 3D-IC solutions Solution includes multi-die layout…
-
Cadence Design Solutions Certified for TSMC-SoIC™ Advanced 3D Chip Stacking Technology
SAN JOSE, Calif., 23 Apr 2019 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC™)…