News – Page 965 – EEJournal

Latest Release of Synopsys’ Design Compiler NXT is Ready for Broad Availability

MOUNTAIN VIEW, Calif., March 13, 2019 /PRNewswire/ — Highlights: Synopsys Design Compiler NXT incorporates innovative and efficient optimization engines delivering faster runtime and improved power and timing…

March 18, 2019

DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit

Rochester, NY – March 14, 2019 – D3 Engineering today announced its new DesignCore® sensor interface card for the NVIDIA Jetson AGX Xavier Developer Kit. The…

March 18, 2019

Pixus Announces New Thick and Rugged Faceplates For Embedded Boards

Waterloo, Ontario — Mar 15, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has released new OpenVPX faceplates for rugged applications. The new 6U OpenVPX…

March 18, 2019

The 11th Annual I LOVE DAC Campaign Kicks Off Registration for the 56th Design Automation Conference

LOUISVILLE, Colo. – March 11, 2019 – Starting today, free registration is open to attend the exhibits and keynotes at the Design Automation Conference, the…

March 18, 2019

Sequential Infiltration Synthesis (SIS) Significantly Improves EUV Patterning

SAN FRANCISCO (US), FEBRUARY 25, 2019 — This week, at the SPIE Advanced Lithography conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and…

March 15, 2019

Power Stamp Alliance Announces Reference Design Board for Next-Generation 10 nm Intel CPU Microarchitecture

[March 14, 2019] – At the OCP Summit 2019, the Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters,…

March 15, 2019

GPIO Port Expander From Diodes Incorporated Provides I2C Interface And Level Shifting For Any Peripheral

Plano, Texas 13 March, 2019 Diodes Incorporated (Nasdaq:DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products within the broad discrete, logic, analog and…

March 15, 2019

ON Semiconductor to Demonstrate Rapid Analysis of Power Solutions Using Advanced Cloud-Connected Strata Developer Studio™ at APEC 2019

ANAHEIM, USA – 13 March, 2019 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will be exhibiting and demonstrating new power solutions boards enabled with…

March 15, 2019

Power Stamp Alliance Announces New Specification for Controller Stamp

[March 14, 2019] – At the OCP Summit 2019, the Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters,…

March 15, 2019

Cadence Announces Industry’s First Verification IP for USB4

SAN JOSE, Calif., March 14, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry’s first Verification IP (VIP) in support of…

March 15, 2019

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