News – Page 976 – EEJournal

AI Innovators Join Forces in Consortium for Development and Commercialization of Best-in-Class AI Computing Platform

Santa Clara, CA, Feb 19, 2019 – Crossbar Inc., Gyrfalcon Technology Inc., mtes Neural Networks Corporation (mNN) and Robosensing Inc. today announced an AI consortium that will…

February 22, 2019

Tech Innovators Speak at Design for Reliability Conference in Baltimore

Beltsville, MD – February 19, 2019 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, will be…

February 22, 2019

New Artesyn 50-Watt, High Current Density, Non-isolated Digital DC-DC Modules are Ideal for 5G Nodes and Height-sensitive Applications

Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1…

February 22, 2019

Green Hills Software to Showcase Its Innovative Security and Safety-critical Solutions at embedded world

SANTA BARBARA, CA — February 19, 2019 —Green Hills Software, the worldwide leader in embedded safety and security, and INTEGRITY Security Services (ISS), a Green Hills…

February 22, 2019

OmniVision Announces Its First 0.8 Micron, 32 Megapixel Image Sensor

SANTA CLARA, Calif. – Feb. 20, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV32A, its first 0.8 micron pixel image sensor with 32 megapixel (MP) resolution, built on…

February 22, 2019

Telit Transforms Wireless Broadband Networking with Blazing Fast 5G Wireless Speeds

Telit announces new data cards based on the Qualcomm® Snapdragon™ X55 5G modem and RF Front-End solutions, the latest in a series of first to market…

February 22, 2019

Flicq and Ioetec Cooperate on Securing the Industrial Internet of Things (IIoT)

San Jose, California & Sheffield, UK. 20th February 2019. Flicq Inc. an innovator in the Industrial Internet of Things (IIoT) solutions and Ioetec Ltd, a…

February 22, 2019

Autotalks and CEVA Collaborate on World’s First Global V2X Solution

MOUNTAIN VIEW, Calif. and Kfar Netter, Israel – February 19, 2019 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for…

February 21, 2019

Renesas Electronics Develops 28 nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures

TOKYO, Japan, February 19, 2019 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development and successful operation verification of an…

February 21, 2019

TE Connectivity’s new stainless-steel D-sub connectors meet demand for nontoxic applications

HARRISBURG, Pa. – February 21, 2019 – TE Connectivity (TE), a world leader in connectivity and sensors, recently released its new line of rugged AMPLIMITE D-subminiature (D-sub) connectors that…

February 21, 2019

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