News – Page 1015 – EEJournal

AMF Photonics SiP Process Design Kit Available for Synopsys OptoDesigner Photonic IC Layout Solution

MOUNTAIN VIEW, Calif., Nov 5, 2018 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) and Advanced Micro Foundry (AMF) today announced that a new, production-ready process design kit (PDK) based…

November 6, 2018

u-blox’s first multi-band GNSS timing receiver meets 5G’s stringent accuracy requirements

Thalwil, Switzerland – November 5, 2018 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the ZED-F9T (https://www.u-blox.com/product/zed-f9t-module) high…

November 6, 2018

Silex Insight unveils high-throughput version of Chacha20-Poly1305 authenticated encryption

Louvain-la-Neuve, Belgium – November 5, 2018 – Silex Insight, leading provider of IP cores for secure computing, presents a new version of its Chacha20-Poly1305 hardware…

November 6, 2018

Full-Bridge 600V/3.5A System-in-Package from STMicroelectronics Delivers Space Savings with Flexibility and Safety

Geneva, November 5, 2018 — STMicroelectronics’ PWD5F60 high-density power driver is the second in a new series of power-driver systems-in-package addressing high-voltage brushed DC and single-phase brushless motor…

November 6, 2018

SiTime Launches the Emerald Platform, a Game-changing MEMS Timing Solution for 5G Infrastructure

Solves critical timing challenges for 5G infrastructure Sets new performance benchmarks–20 times better–in the $1.5 billion telecom and networking timing market Unprecedented ease-of-use and programmability…

November 6, 2018

UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series

November 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces the launch of its UF3C FAST series of 650…

November 5, 2018

OmniVision’s New 16-MP Image Sensor Brings Top Performance and High Resolution to Mainstream Smartphone Market

SANTA CLARA, Calif. – Oct. 31, 2018 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV16E10—the latest generation of its high-performance 16-megapixel (MP) image sensor family. Built on OmniVision’s latest 1.12-micron PureCel® Plus stacked…

November 5, 2018

Netronome Announces Open Chiplet Architecture for Advanced SoC Designs

Democratizes Production of Integrated Silicon Products for High-Performance Machine Learning, Security and Networking Applications by Enabling Integration of Best-of-Breed Components While Significantly Reducing Development Costs…

November 5, 2018

Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth

Mountain View, Calif., October 31, 2018 – Flex Logixâ Technologies, Inc. today announced that it has leveraged its core patent-protected interconnect technology from its embedded FPGA (eFPGA) line of…

November 5, 2018

Sensera further expands fabrication capabilities with dicing, wafer bonding and electroplating technologies

Sensera Inc. (ASX: SE1), a leading provider of MEMS devices and Internet of Things (IoT) solution provider that delivers sensor-based products transforming real-time data into meaningful information,…

November 5, 2018

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