News – Page 1016 – EEJournal

Matrox Imaging Reveals New Addition to Matrox Concord Family of GigE Vision Adaptor Cards

MONTREAL, Quebec, 2 November 2018 — Matrox® Imaging today announces the Matrox Concord PoE with ToE, a new addition to the Matrox Concord family of network adaptor cards…

November 5, 2018

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers.…

November 2, 2018

Panasonic Industry Europe expands its Conductive Polymer Hybrid Capacitor portfolio

Munich, November 2018: Panasonic Industry Europe is expanding its Conductive Polymer Hybrid Capacitors portfolio for the second time this year with the addition of a sixth…

November 2, 2018

Pixus Releases New Development Chassis for 3U OpenVPX Boards

Waterloo, Ontario — Nov 01, 2018 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has released 3U versions of its low-cost open frame development platform…

November 2, 2018

Mouser Signs Global Distribution Agreement with Sudo Systems to Stock High-Performance SudoProc SoM for IoT Designs

October 31, 2018 – Mouser Electronics, Inc. announces that it has entered into a distribution agreement with Sudo Systems, an innovator in high-performance embedded systems for next-generation Internet of Things (IoT)…

November 2, 2018

Reflex Photonics’ SpaceABLE radiation-resistant optical transceivers to successfully reach more than 4000 h of accelerated life test for GEO 20 years life applications.

Kirkland (Montréal), October 30, 2018: Reflex Photonics is proud to announce that its SpaceABLE™ SM radiation-resistant transceivers have exceeded the minimal requirement of 2500 h of…

November 1, 2018

HCC Expands its Fail-Safe Flash Translation Layer for NAND to Include Deterministic Operation for Automotive, Aerospace, and Industrial Applications

Budapest, Hungary – 16 October 2018 – HCC Embedded (HCC), long-time experts in fail-safe and reliable NAND flash software, has extended its existing flash translation layer (FTL)…

November 1, 2018

OmniVision Announces Industry’s First Single-Chip 1080p LCOS Microdisplay With Integrated Driver for AR/VR and Projector Designs

SANTA CLARA, Calif. – Oct. 30, 2018 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OP02220—the industry’s first 1080p liquid crystal on silicon (LCOS) microdisplay with integrated driver functions and…

October 31, 2018

TI introduces first multiprotocol gigabit TSN-enabled processors for Industry 4.0

DALLAS (Oct. 30, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new,…

October 31, 2018

Synopsys Enhances DesignWare Memory Test and Repair Solution for Embedded MRAM

MOUNTAIN VIEW, Calif., Oct. 30, 2018 /PRNewswire/ — Highlights: DesignWare STAR Memory System’s full suite of test, repair, and diagnostic capabilities for embedded MRAM optimize test time…

October 31, 2018

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