Archives: News
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Renesas Electronics RX65N Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2
TOKYO, Japan, October 29, 2018― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, is accelerating the development of robotics systems to deliver…
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Pentek’s New Quartz RFSoC Development Platform Speeds Application Design
Low-cost, single-slot 3U VPX development chassis Supports Pentek’s Quartz RFSoC FPGA products Dual MPO optical interfaces support 100 GigE high-speed data streaming Ideal for defense, radar, wireless, SIGINT…
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Always-On Inertial Measurement Unit from STMicroelectronics Improves Accuracy, Optimizes System Power
Geneva, October 29, 2018 — The LSM6DSO iNEMO™ Inertial Measurement Unit (IMU) from STMicroelectronics is an always-on 3D accelerometer and 3D gyroscope system-in-package that is, by itself, extremely…
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LoRa Alliance™ Enhances LoRaWAN™ Protocol with New Specifications to Support Firmware Updates Over the Air
TOKYO – October 25, 2018 – The LoRa Alliance™, the global association of companies backing the open LoRaWAN™ protocol for Internet of Things (IoT) low-power wide-area networks…
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Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families
TOKYO, Japan, October 25, 2018 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core,…
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Maxim Delivers Industry’s Widest Voltage Range and Smallest Footprint with Himalaya uSLIC Family Additions
SAN JOSE, Calif.—Oct. 24, 2018—Now engineers designing into applications in factory automation, medical, communications and consumer markets can tap into four new micro-system-level IC (“uSLIC™”)…
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Rohde & Schwarz and Huawei successfully perform LTE-V interoperability tests to make connected vehicles reality
Rohde & Schwarz and Huawei have successfully tested the interoperability of LTE-V connected vehicles with the R&S CMW500 wideband radio communication tester using the embedded…
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Leti Middleware Will Be Core of Fog Platform for Decentralized Cloud-to-Edge AI
GRENOBLE, France – Oct. 25, 2018 – Leti, a research institute at CEA-Tech, today announced that its sensiNact Internet of Things (IoT) middleware will be…
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u-blox announces multiradio and gateway modules with concurrent Wi-Fi and dual-mode Bluetooth connectivity
Thalwil, Switzerland – October 24, 2018 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the NINA-W15 ( https://www.u-blox.com/product/nina-w15-series) multiradio…
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Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families
Düsseldorf, October 25, 2018 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the…