Archives: News
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Embedded Studio 4.10 for ARM released – Putting the executable on a diet!
Monheim, Germany – October 25th, 2018 “Bigger is better” is not true when it comes to program size of Embedded Computing Systems. Less is more.…
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ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018
eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two DFT-related presentations at the International Test Conference…
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DDC-I to Sponsor NXP Workshop on Multicore for Avionics
Phoenix, AZ – October 22, 2018. DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced that it will…
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Highly accurate digital temperature sensors provide unparalleled simplicity for RTD-based and medical designs
DALLAS (Oct. 25, 2018) – Texas Instruments (TI) (NASDAQ:TXN) today introduced a new temperature sensor family that offers ±0.1°C accuracy across a wide temperature range…
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GENIVI Alliance Tech Summit Shines Light on Essential Automotive Software Challenges and Solutions
SAN RAMON, Calif., Oct. 23, 2018 /PRNewswire/ — The GENIVI Alliance, an open community of automakers and suppliers driving the adoption of open source software for the…
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Reflex Photonics launches midboard LightVISION optical transceiver with MPO interface for increased design flexibility and performance in high-bandwidth communication application.
Kirkland (Montréal), October 24, 2018: Reflex Photonics is proud to introduce the LightVISION™ midboard optical transceiver solution for high-density servers and tactical data centers. The…
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UltraSoC and ResilTech partner to further functional safety in automotive systems
CAMBRIDGE, UK – 25 October 2018 UltraSoC and ResilTech today announced a collaboration that brings together their expertise and technologies to further the functional safety compliance of automotive…
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Sharing your own car via an app: Infineon and XAIN to collaborate on bringing blockchain into the car
Munich, Germany – 25 October 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and XAIN have agreed to work together on bringing blockchain…
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Rohde & Schwarz significantly increases functionality of R&S ELEKTRA EMC test software
Munich, October 24, 2018 — EMC market leader Rohde & Schwarz introduces additional options for the existing R&S ELEKTRA EMC test software family to cover…
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VadaTech Announces new 3U VPX Virtex UltraScale+ FPGA Board with 5.4 GSPS 12-bit ADC and 6 GSPS 12-bit DAC
Henderson, NV – October 24, 2017 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX570. The VPX570is a…