News – Page 1020 – EEJournal

GCT Semiconductor Complements Cellular Network with Sigfox

Berlin, Germany – October 25, 2018 – Sigfox, the global Low Power Wide Area Network (LPWAN) connectivity provider, and GCT Semiconductor, a leading designer and supplier of advanced 4G mobile…

October 25, 2018

Infineon to drive edge-computing based applications running on Amazon Web Services

Munich, Germany – 19 October 2018 – Semiconductors are key components for the Internet of Things (IoT). They connect the real with the digital world…

October 25, 2018

Imec and ASML Enter Next Stage of EUV Lithography Collaboration

LEUVEN (Belgium) & VELDHOVEN (The Netherlands), OCTOBER 22, 2018 —Today, world-leading research and innovation hub in nanoelectronics and digital technologies imec, and ASML Holding N.V.…

October 25, 2018

Renesas and BlackBerry Deliver R-Car Based Development Environment Integrating Virtualization, Functional Safety, and Security

TOKYO, Japan, October 23, 2018―Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, and BlackBerry Limited (NYSE: BB; TSX: BB) today announced…

October 24, 2018

Matrox Imaging Now Offering Professional Services to Assist with Project Development

MONTREAL, Quebec, 23 October 2018 — Matrox® Imaging is pleased to announce their new Matrox Professional Services offering. Backed by Matrox Applications Engineers and the Matrox Vision Squad—a team…

October 24, 2018

Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop

Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California. Indium Corporation’s metallic TIMs are easy…

October 24, 2018

ESD Alliance Announces ES Design West Debut in Conjunction with SEMICON West 2019 in San Francisco

MILPITAS, CALIF. –– October 24, 2018 –– The Electronic System Design Alliance, a SEMI Strategic Association Partner, today announced the inaugural ES Design West to…

October 24, 2018

Cadence Accelerates Next-Generation Cloud Datacenter Infrastructure with Industry’s First Silicon-Proven, Long-Reach 7nm 112G SerDes IP

SAN JOSE, Calif., 22 Oct 2018 Cadence Design Systems, Inc. (NASDAQ: CDNS) today unveiled the industry’s first silicon-proven, long-reach 112G SerDes IP in 7nm. The…

October 24, 2018

RS Components expands RS Pro offering with range of current transformers

London, UK, 24 October, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel distributor, has announced availability of…

October 24, 2018

New Alliance Memory High-Speed CMOS PSRAMs Offer Densities From 8Mb to 128Mb in 48-Ball and 49-Ball FPBGA Packages

SAN CARLOS, Calif. — Oct. 24, 2018 — Alliance Memory today introduced a new family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb…

October 24, 2018

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