News – Page 1111 – EEJournal

Coventor Adds Device Analysis Capabilities to SEMulator3D 7.0

CARY, NC– February 26, 2018 – Coventor, Inc., a Lam Research Company, the leading supplier of design automation solutions for semiconductor devices and micro-electromechanical systems…

February 28, 2018

GreenWaves Technologies Unveils GAP8, the Industry’s Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge

Grenoble, France, Feb. 26, 2018 – GreenWaves Technologies, a fabless semiconductor startup designing disruptive ultra-low power embedded solutions for image, sound and vibration AI processing in…

February 28, 2018

Imec and Cadence Tape Out Industry’s First 3nm Test Chip

LEUVEN, Belgium and SAN JOSE, Calif., February 28, 2018—The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ:…

February 28, 2018

PoLTE Collaborates with Sequans to Develop Next Generation Location Positioning Solution for IoT

DALLAS, February 22, 2018 – PoLTE Corporation today announced a new initiative with Sequans Communications (NYSE: SQNS) whereby the two companies will prototype a joint solution integrating PoLTE positioning technology…

February 28, 2018

Altium Showcases TASKING Toolset and LAPACK Performance Libraries for Infineon at Embedded World

San Diego, Calif. – 27 February 2018 – Altium, a global provider of embedded software tools for automotive technology, is excited to showcase the full TASKING Toolset…

February 28, 2018

Low-Cost Debugging and Programming is Now Faster and More Feature Rich with MPLAB® PICkit™ 4 Development Tool

CHANDLER, Ariz., Feb 27, 2018 — The debugging process remains an important area where many embedded design engineers would like to see improvements, according to AspenCore’s 2017…

February 28, 2018

New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor

San Diego, CA, USA February 27, 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces a deployment ready…

February 28, 2018

Renesas Synergy™ Strengthens Chip-to-Cloud IoT Connectivity with New Enterprise Cloud Toolbox

TOKYO, Japan, February 27, 2018 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the new Renesas Synergy™ Enterprise Cloud Toolbox v1.1 — a software Application…

February 28, 2018

HCC Embedded Releases MISRA-Compliant EAP Framework for Secure IoT Networks

Nürnberg, Germany – 26 February 2018 – HCC Embedded, experts in software for securely storing and communicating embedded data, has released an embedded Extensible Authentication Protocol (EAP) framework to…

February 28, 2018

Imec Pushes the Limits of EUV Lithography Single Exposure for Logic N5 Metal Layers and Dense DRAM Applications

LEUVEN (Belgium), February 26, 2018 – Imec, the world-leading research and innovation hub in nanoelectronics and digital technology, continues to advance the readiness of EUV lithography with…

February 28, 2018

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