News – Page 1113 – EEJournal

Renesas Electronics Shortens Evaluation Time of Industrial Networking Applications with RZ/N1L Solution Kit for Remote IO and Communication Modules

TOKYO, Japan, February 26, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its latest solution kit based on the RZ/N1L Group…

February 27, 2018

Intel Ships Industry’s First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV

Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the industry’s only field programmable gate array (FPGA) with 58G PAM4 transceiver…

February 26, 2018

Suprema to showcase AI based in-display fingerprint algorithm and 3D facial recognition solution at MWC 2018

– BioSign 3.0, now supports in-display fingerprint sensors – LookSign, 3D facial recognition solution for smartphones Feb 22, 2018 – (ACN Newswire) – Suprema, a…

February 26, 2018

Express Logic’s X-Ware IoT Platform® Delivers Seamless Connectivity to Alibaba, Amazon Web Services (AWS), Baidu, Google Cloud Platform, IBM Cloud, Microsoft Azure, Oracle Cloud, Tencent, and Xively

Nuremberg, Germany, February 26, 2018 — Express Logic, provider of the comprehensive X-Ware IoT Platform® powered by the industry leading ThreadX® RTOS, announced today turnkey support for all the leading cloud…

February 26, 2018

Archives: News

Renesas Electronics Shortens Evaluation Time of Industrial Networking Applications with RZ/N1L Solution Kit for Remote IO and Communication Modules

Intel Ships Industry’s First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV

Suprema to showcase AI based in-display fingerprint algorithm and 3D facial recognition solution at MWC 2018

Express Logic’s X-Ware IoT Platform® Delivers Seamless Connectivity to Alibaba, Amazon Web Services (AWS), Baidu, Google Cloud Platform, IBM Cloud, Microsoft Azure, Oracle Cloud, Tencent, and Xively

Irresistible Materials Ramps Up Production of Breakthrough EUV Photo-Resist and Spin-on-Carbon Materials

Rohde & Schwarz and CommSolid present world’s first test solution for 3GPP Release 14 location services for NB-IoT

Barr Group’s 2018 Embedded Systems Safety & Security Survey Reveals Little Movement Toward Safer Product Development

Synopsys Delivers Industry’s First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage

MaxLinear Strengthens Wireless Transport Product Portfolio with 5Gbps, 16K QAM-based Microwave Modem SoC

Achronix’s Steve Mensor Joins Expert Panel Addressing eFPGA Ecosystem During NDIA