News – Page 1114 – EEJournal

DoD-compliant Removable Storage Module Added to Aitech’s Low Power, High Performance Rugged Compact PC (RCP)

Technical Specifications Removable mass storage offers quick/secure erase (DoD 5220.22-M) and unrecoverable data destruct SWaP-optimized at less than 5 lbs (2.25 kg) in compact, low-profile…

February 26, 2018

LDRA Leverages Versatility and Power of the Mac Platform with the LDRA tool suite® for Mac OS

Wirral, U.K. – February 26, 2018 – LDRA, the leader in standards compliance, automated software verification, software code analysis, and test tools, has responded to customer requests for…

February 26, 2018

STMicroelectronics and USound Demonstrate Immersive Listening Experiences with Advanced Micro-Speakers in 3D-Sound Headphones at MWC 2018

MEMS speakers developed by USound and manufactured by STMicroelectronics combine minuscule size, low profile, and high efficiency enabling multiple speakers in wearable form factors…

February 26, 2018

STMicroelectronics Powers Next-Generation IoT Devices with Higher-Performing Multiprotocol Bluetooth® & 802.15.4 System-on-Chip

Fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates high-performing wireless platform for feature-rich smart connected objects Dual…

February 23, 2018

CEVA Introduces PentaG™ – A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices

3GPP Rel-15 compliant platform lowers high entry barriers for 5G modem design, with fast time-to-market and minimal risk Composed of combination of special purpose DSPs…

February 23, 2018

Archives: News

DoD-compliant Removable Storage Module Added to Aitech’s Low Power, High Performance Rugged Compact PC (RCP)

LDRA Leverages Versatility and Power of the Mac Platform with the LDRA tool suite® for Mac OS

STMicroelectronics and USound Demonstrate Immersive Listening Experiences with Advanced Micro-Speakers in 3D-Sound Headphones at MWC 2018

STMicroelectronics Powers Next-Generation IoT Devices with Higher-Performing Multiprotocol Bluetooth® & 802.15.4 System-on-Chip

CEVA Introduces PentaG™ – A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices

Ellisys Increases Support for Bluetooth® Mesh Networking on Protocol Solutions

Newark element14 to deliver 100,000 micro:bits to teach Canadian Children to Code

Industry’s smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent

Pentek Announces Talon Rugged Small Form Factor RF/IF Recorders Optimized for SWaP

Telit Announces World’s Fastest Mobile Data Product, First 1Gbps-class LTE Mini PCIe Card