News – Page 1153 – EEJournal

Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores

OXFORD, United Kingdom–(BUSINESS WIRE)–Imperas Software Ltd., the leader in high-performance software simulation and virtual platforms, and Andes Technology Corporation, today announced their partnership to provide…

November 22, 2017

Rohde & Schwarz delivers 5G NR sub-6 GHz device testing platform

Munich, November 22, 2017 — Rohde & Schwarz, a leading supplier of test and measurement equipment, is enabling the testing and validation of sub-6 GHz 3GPP 5G…

November 22, 2017

Wide range of Fibre Optic Connectors now available from Cliff Electronics

Cliff Electronics manufacture a wide range of optical connectors suitable for high quality audio systems, broadcast, AV installations, home theatre, automation, instrumentation, data and IT connectivity, medical…

November 22, 2017

IAR Systems delivers powerful development tools for NXP’s new i.MX RT series

Uppsala, Sweden—November 22, 2017—IAR Systems®, the future-proof supplier of software tools and services for embedded development, presents tools support for NXP’s i.MX RT crossover processor,…

November 22, 2017

Intermolecular and SITRI Form Strategic Alliance to Accelerate Materials Innovation – “More than Moore”

SAN JOSE, Calif. and Shanghai, November 20, 2017 — Intermolecular, Inc. (NASDAQ: IMI), the trusted partner for advanced materials innovation and SITRI, the innovation center for…

November 21, 2017

Small Size Color E-paper Displays Integrate Controller Electronics for Reduced Cost and Time to Market

Tainan City, Taiwan – 21 November 2017. Pervasive Displays (PDi), a world leader in e-paper displays, today announces samples available for four new, small size, high…

November 21, 2017

TT Electronics introduces the lightest, most effective PCB mounted heatsink specifically designed for power resistors

Woking, UK, 21 November 2017 – TT Electronics, a global provider of engineered electronics for performance critical applications, has today announced the WMHP-HS heatsink specifically designed to…

November 21, 2017

Tosibox Trusted Partner in Cyber Security for Fidelix, a Finnish Leader in Building Automation Systems

OULU, FINLAND – Tosibox, the innovator of easy, scalable, reliable and secure remote connections offers modern-day cyber security for Fidelix, the market leader in building automation in…

November 20, 2017

Avalue Announces the Latest Embedded Products with Intel® Apollo Lake Processor, including ECM-APL2, EQM-APL, EPC-APL and VMS-APL

TAIPEI, TAIWAN, November 20th, 2017 – Avalue Technology Inc. (TAIEX: 3479-TW), global embedded solution provider, an associate member of Intel® Internet of Things Solutions Alliance. Avalue announces the latest…

November 20, 2017

Ametherm Glass-Encapsulated Thermistors for Automotive and Industrial Applications Now in Stock at Digi-Key

CARSON CITY, Nev. — Nov. 20, 2017 — Ametherm today announced that its DG series of glass-encapsulated thermistors for high-accuracy temperature sensing in automotive and…

November 20, 2017

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