News – Page 1154 – EEJournal

Barr Group Discounts Embedded Software Training in a Box™ Course

GERMANTOWN, Maryland – November 20, 2017 – Through December 31, 2017, Barr Group is offering a $50 discount on its Embedded Software Training in a Box™ course. Based on Barr Group’s Embedded…

November 20, 2017

Sub-miniature PCB mount Toggle Switch from JPR Electronics saves panel and PCB space

Specialist distributors JPR Electronics is the UK distributor of the Salecom TS40-T range of sub-miniature toggle switches. This compact switch offers designers space savings on PCB layouts…

November 20, 2017

Digitizers allow fast and easy signal processing with new SCAPP Option

Grosshansdorf, Germany – 20th November 2017. Currently digitizers have a bottleneck caused by having to use either the host PC’s central processor with 8 or 16 cores…

November 20, 2017

Avnet Expands Commitment to Technology Innovation with First Americas-Based Design Center of Excellence

PHOENIX — November 20, 2017 — Avnet (NYSE:AVT), a leading global technology distributor, unveiled its first Design Center of Excellence in the Americas during a grand opening ceremony…

November 20, 2017

Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet Transport Applications

MILPITAS, Calif., Nov. 13, 2017 (GLOBE NEWSWIRE) — Open-Silicon today announced the availability of a comprehensive IP subsystem targeted at high-bandwidth networking applications. The subsystem…

November 20, 2017

New 3U VITA 62-compliant PSU Meets Power and Reliability Demands of Rugged, High Density Embedded Systems

Technical Specifications: 3U, VITA 62 PSU Up to 500 W output capacity; wide input voltage 18-32 VDC Comprehensive input and output protection Input power line…

November 17, 2017

Global Unichip Successfully Tapes Out 16nm TCAM Compiler

Hsinchu, Taiwan, November 16, 2017 – Global Unichip Corp. (GUC), the Custom ASIC Leader, successfully taped its newest high speed TCAM compiler, specifically designed for…

November 17, 2017

Huawei and Gemalto team up to accelerate NarrowBand IoT deployments

Amsterdam, 14 November, 2017 – To help device manufacturers meet a growing demand for long-lasting low-power NarrowBand (NB) IoT modules, Gemalto and Huawei – via its semiconductor arm,…

November 17, 2017

RS Components takes affordable thermal imaging to the next level with new FLIR ONE® Pro

LONDON, UK, 16 November, 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, is among the first…

November 17, 2017

New Artesyn Embedded Technologies 15 W and 20 W DC-DC Converters Feature Medical Safety Approvals

Artesyn Embedded Technologies today announced the AEE15W-M and AEE20W-M series, new 15 and 20 watt dc-dc converters that provide OEMs with an economical solution for demanding applications in industrial and…

November 16, 2017

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