News – Page 1181 – EEJournal

600V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives

Geneva, September 14, 2017 — New SLLIMM™-nano intelligent power modules (IPM) from STMicroelectronics introduce extra package options and integrate additional components to accelerate development and simplify assembly of…

September 14, 2017

HCC Embedded’s Extensive Suite of Advanced Middleware Now Available for Xilinx Zynq-7000 SoCs

Campbell, California – Sept. 14, 2017 – HCC Embedded, experts in software for securely storing and communicating embedded data, has added support for the Xilinx Zynq®-7000 All Programmable system-on-chip (SoC)…

September 14, 2017

Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem

MOUNTAIN VIEW, Calif., and TIRAT CARMEL, Israel, Sept. 13, 2017 /PRNewswire/ — Highlights: Alango’s Voice Enhancement Package (VEP) offers multi-microphone beamforming array and echo cancellation technologies to enhance…

September 13, 2017

Archives: News

600V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives

HCC Embedded’s Extensive Suite of Advanced Middleware Now Available for Xilinx Zynq-7000 SoCs

Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem

Announcing Thermal-Mechanical Analysis with Sherlock 5.3

VadaTech announces the FMC216 per VITA 57

Synopsys IC Compiler II Certified for TSMC’s Advanced 7-nm FinFET Plus Node

Renesas Electronics Delivers PLC Solution that Enables Voice Communication over Power Lines

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Qorvo® Multi-Channel IoT Transceiver is First Certified for Thread Protocol

Synopsys and TSMC Collaborate to Develop DesignWare Foundation IP for Low-Power TSMC 40-nm eFlash Processes