News – Page 1183 – EEJournal

Xilinx, Arm, Cadence, and TSMC Announce World’s First CCIX Silicon Demonstration Vehicle in 7nm Process Technology

Hsinchu, Taiwan, R.O.C. – September 11, 2017 – Xilinx (NASDAQ: XLNX), Arm, Cadence Design Systems, Inc. (NASDAQ: CDNS) and TSMC (TWSE: 2330, NYSE: TSM) today announced a…

September 11, 2017

EMA Adds Quadcept Output and New Symbol Options To Ultra Librarian Website and Desktop Software

Rochester, NY (September 11, 2017) – EMA Design Automation® (www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, today announced two new options…

September 11, 2017

SolarEdge and LG Electronics Join Forces to Provide New Solar Modules for the North American Market

LAS VEGAS, NV — September 11, 2017 —SolarEdge Technologies, Inc. (“SolarEdge”) (NASDAQ: SEDG), a global leader in PV inverters, power optimizers and module-level monitoring services, and solar panel…

September 11, 2017

Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process

SAN JOSE, Calif., 11 Sep 2017 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Cadence® digital, signoff and custom/analog tools and flows have achieved v1.0…

September 11, 2017

eSilicon at TSMC OIP 2017: High-Performance 7FF IP Platform and 7FF HBM2/LL HBM Combo PHY

eSilicon, an independent provider of FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions, will deliver several presentations in booth 807 at the 2017…

September 8, 2017

Movandi Brings Innovative RF Front End Technology to Emerging High Frequency, Millimeter Wave Networks for 5G and Beyond

NEWPORT BEACH, Calif., September 6, 2017 – MWC Americas – Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX…

September 8, 2017

Microsemi’s Cost-Optimized, Low Power Mid-Range PolarFire FPGAs Now Interoperate with Analog Devices’ AD9371 Wideband RF Transceiver

ALISO VIEJO, Calif. —Sept. 6, 2017—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its cost-optimized, low power,…

September 8, 2017

Archives: News

Xilinx, Arm, Cadence, and TSMC Announce World’s First CCIX Silicon Demonstration Vehicle in 7nm Process Technology

EMA Adds Quadcept Output and New Symbol Options To Ultra Librarian Website and Desktop Software

SolarEdge and LG Electronics Join Forces to Provide New Solar Modules for the North American Market

Cadence Tools and Flows Achieve Production-Ready Certification for TSMC’s 12FFC Process

eSilicon at TSMC OIP 2017: High-Performance 7FF IP Platform and 7FF HBM2/LL HBM Combo PHY

Movandi Brings Innovative RF Front End Technology to Emerging High Frequency, Millimeter Wave Networks for 5G and Beyond

Microsemi’s Cost-Optimized, Low Power Mid-Range PolarFire FPGAs Now Interoperate with Analog Devices’ AD9371 Wideband RF Transceiver

Pixus Announces OpenVPX Development ATR Enclosure

XP Power releases compact, high-efficiency 750W AC-DC power supplies with industrial and medical approvals

Cadence Announces Legato Memory Solution, Industry’s First Integrated Memory Design and Verification Solution