Archives: News
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Low-Voltage 64 Megabit Serial Quad I/O™ SuperFlash® Memory from Microchip Improves Power Consumption in Battery-Powered Devices
CHANDLER, Ariz., Sept. 5, 2017 — A new 1.8V Serial Quad I/O™ SuperFlash® memory device is now available from Microchip Technology Inc. (NASDAQ: MCHP). The SST26WF064C, a low-voltage…
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Quickly Develop Quality Power Supplies with Maxim’s EE-Sim DC-DC Converter Tool
San Jose, CA—September 5, 2017—Power novices can now create custom designs with speed and confidence, while power experts can develop finely crafted circuits using the…
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Menta Embeds sureCore Low Power SRAM IP on TSMC’s 28nm Process
Montpellier, France, September 6, 2017 — Menta SAS, a leading embedded FPGA (eFPGA) Intellectual Property (IP) provider, and sureCore Ltd., a low-power SRAM IP leader, today opened the…
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Imec Reports World-Class Low-Power IP Blocks for 5G
LEUVEN, Belgium—Sept. 6, 2017–Today, at its Imec Technology Forum Southeast Asia in Singapore, imec, the world-leading research and innovation hub in nano-electronics and digital technology,…
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Silicon Labs Collaborates with Microsoft to Accelerate Internet of Things Solutions — Verified Hardware and Software Enhance Interoperability and Allow Faster Time to Production
AUSTIN, Texas – Sept. 5, 2017 – Silicon Labs (NASDAQ: SLAB) today announced that it has joined Microsoft Azure Certified for Internet of Things (IoT),…
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Synopsys Experts, Customers and Partners to Present the Latest Trends and Technologies in Embedded Processor Solutions
MOUNTAIN VIEW, Calif., Sept. 6, 2017 /PRNewswire/ — WHEN: Tuesday, September 26 from 8:30 a.m. to 7:00 p.m. WHERE: Santa Clara Marriott, 2700 Mission College Boulevard, Santa Clara, CA REGISTER: www.synopsys.com/ARCsummit Synopsys, Inc. (Nasdaq:…
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58VIN, 24W, Inverting µModule Regulator Is EN55022 Class B Compliant
MILPITAS, CA & NORWOOD, MA – September 6, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM4651, a nonisolated inverting…
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Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects
Geneva, September 6, 2017 – To help product innovators streamline prototyping and development of connected smart objects, STMicroelectronics has created the SPBTLE-1S ready-to-use Bluetooth® Low Energy (BLE) module that integrates all…
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Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications
GRENOBLE, France – Sept. 5, 2017 – Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more…
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Flex Logix Joins TSMC IP Alliance Program
Mountain View, Calif., September 5, 2017 – Flex Logixä Technologies, Inc., the leading supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance…