Archives: News
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Huawei Brings World’s First Multi-Carrier eMTC Module ME309 to North America
PLANO, Texas, July 20, 2017 /PRNewswire/ — Huawei, a leading telecommunications solutions provider, today announced the availability of the LTE CAT M ME309-562 LGA module in North America in…
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LDRA Provides Only Commercially Available Object Code Verification for Avionics Industry’s Upgrade to Newest PowerPC chips
Wirral, U.K. – July 20, 2017 – LDRA, the leader in standards compliance, automated software verification, software code analysis, and test tools,has updated the LDRA tool suite for the PowerPC assembler language to…
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Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement
SAN JOSE, Calif., July 20, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Toshiba Electronic Devices & Storage Corporation used the Cadence® Genusâ„¢ Synthesis Solution…
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Diving into MEMS, Sensors and Imaging Technologies for a Smart, Connected World at SEMI|MSIG European Summit
GRENOBLE, France ─ July 20, 2017 – STMicroelectronics CEO Carlo Bozotti will kick off SEMI® and MEMS & Sensors Industry Group®’s(MSIG) co-located European MEMS & Sensors Summit 2017 and European Imaging & Sensors…
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New Line of PCI Express Mini Cards for Easy and Flexible Digital I/O Expansion
July 18, 2017—SAN DIEGO, CA — ACCES I/O Products, Inc., is pleased to announce the release of a new family of mini PCI Express (mPCIe)…
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ams launches smallest available XYZ tri-stimulus sensor for True Color consumer applications
Premstaetten, Austria (19 July, 2017) —Â ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today released the TCS3430, the first XYZ tri-stimulus…
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Sundance announces the SMT6657 – the highest performance PC/104 embedded processing module ever
Chosen for the SIS100 Proton Accelerator at the new Facility for Antiproton and Ion Research in Europe (FAIR) Digital processing provided by on-board TI Keystone® DSP Versatility, pre/post…
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STMicroelectronics’ ESD-Clamping Diodes in 0201 Package Bring Industry-Best Performance Protection to Tiny Smart Objects
New miniature (0201-size) single-line ESD-protection diodes from STMicroelectronics quickly clamp transients to a voltage as low as 7V, and handle 7A peak pulse current, to…
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Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM

SAN JOSE, Calif., July 19, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Functional Safety Verification Solution was adopted by ROHM CO., Ltd.…
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BrainChip Launches New AI-powered Software that Accelerates Pattern Search and Facial Classification
Aliso Viejo, California – July 19th, 2017 BrainChip Holdings Ltd., (ASX: BRN) (“BrainChip” or “the Company”), a leading developer of software and hardware accelerated solutions for advanced…