News – Page 1199 – EEJournal

New Artesyn Server Blade brings Latest Processors to Military, Aerospace and Government Networked Systems

Artesyn Embedded Technologies today launched a powerful new packet processing and high performance server blade, the ATCA-7540, based on dual Intel® Xeon® Scalable processors (codename Skylake), which were…

July 19, 2017

AVX Antenna PowerGuard Products Provide Reliable ESD Protection in Capacitance-Sensitive Applications

FOUNTAIN INN, S.C. (July 19, 2017) — AVX Corporation, a leading manufacturer and supplier of advanced passive components and interconnect solutions, has released the new Antenna…

July 19, 2017

element14 community launches ‘IoT on Wheels’ Design Challenge with STMicroelectronics

Chicago, United States, 19 July 2017 – element14.com, the world’s largest electronic design community, has launched a new Design Challenge for designers and engineers called ‘IoT on Wheels’. …

July 19, 2017

CommAgility software and hardware used in 5G COHERENT research project

Loughborough, UK – 19th July 2017 — CommAgility, a Wireless Telecom Group company (NYSE MKT: WTT), announces that it is participating in the COHERENT research project, which is…

July 19, 2017

TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power Delivery support

DALLAS (July 18, 2017) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a pair of highly flexible, single-chip buck-boost battery charge controllers for one- to…

July 18, 2017

RS Components adds robust and high-specification industrial micro-miniature connectors

OXFORD, UK, 18 July, 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has announced availability of a new…

July 18, 2017

Premier Farnell announce winners in ‘Change the World’ global design competition

Chicago, Illinois 18 July 2017 – Premier Farnell, The Development Distributor, have completed the process of shortlisting entries for their global design competition ‘Change the World’. The…

July 18, 2017

L-com Debuts New Line of Space-Saving Mini-Coupler Patch Panels

NORTH ANDOVER, Mass. (July 18, 2017) – L-com Global Connectivity, a preferred manufacturer of wired and wireless connectivity products, announced today that it has launched a…

July 18, 2017

Macronix Launches AEC-Q100 Full Compliant NAND Flash Memory

Hsinchu, Taiwan, 18 July, 2017 – Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the Non-Volatile Memory (NVM) market, today announced that it…

July 18, 2017

TEWS TECHNOLOGIES Adds New User-Programmable FPGA Module to Expanding Line of XMCs

Halstenbek, Germany – July 17th, 2017: TEWS TECHNOLOGIES increases its I/O offering with the TXMC638, a standard single-width Switched Mezzanine Card (XMC) compatible module providing…

July 18, 2017

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