Archives: News
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Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets
MOUNTAIN VIEW, Calif., – February 21, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and Waves Audio, the…
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MaxLinear Showcases 5G & Backhaul Leadership with New Family of Broadband Microwave Transceivers
Barcelona – Feb. 23, 2017 – MaxLinear Inc. (NYSE: MXL), a leading provider of radio frequency (RF) and mixed-signal integrated circuits for the connected home and wired and wireless infrastructure…
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u-blox launches ground-breaking super-low-power GNSS receiver chip for wearable applications
Thalwil, Switzerland – February 21, 2017 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today announced the launch of its…
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Pixus Offers Hard-To-Find Rails and Other Subrack Components
Waterloo, Ontario — Feb 23, 2017  – Pixus Technologies, a provider of embedded computing and enclosure solutions, offers specialty extruded rails and other components for…
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Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP
SAN JOSE, Calif., 23 Feb 2017 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its collaboration with Alango Technologies Ltd., a leading provider of voice…
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VadaTech launches a dual-channel IF signal conditioning unit
Henderson, NV – February 21, 2016 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC902, a dual-channel…
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CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity
CEVA-XC12 is the industry’s first DSP capable of meeting the extreme performance requirements critical to the success of 5G, gigabit LTE, MU-MIMO Wi-Fi and other…
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Sequans and Orion Labs Partner to Develop First LTE-enabled Wearable with Monarch LTE-M Chip
PARIS, France and SAN FRANCISCO, California – February 23, 2017 – LTE chipmaker Sequans Communications S.A. (NYSE: SQNS) and Orion Labs, a leader in communication technology dedicated to connecting people…
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STMicroelectronics Works with Sigfox to Extend Plug-and-Play IoT Security to Industrial and Consumer Device Makers
GENEVA, February 23, 2017 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the expansion of its STSAFE family of secure…
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New Bidirectional Power-Switching Solution is One of the Industry’s Smallest
HARRISBURG, Pa. – February 23, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, has released an additional size for the KILOVAC…