Archives: News
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Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs
SAN JOSE, Calif. and KNOXVILLE, Tenn., 23 Feb 2017 Cadence Design Systems, Inc. (NASDAQ: CDNS) and Waves Audio Ltd., the world-leading developer of audio DSP…
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Renesas Electronics Europe: Third European MCU Car Rally Competition Showcases Student Creativity with State-of-the-Art Renesas Solutions at Embedded World 2017
Dusseldorf, February 23, 2017 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, today announced that the third MCU Car Rally competition will take place at…
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Tiny fibers open new windows into the brain
CAMBRIDGE, Mass. — For the first time ever, a single flexible fiber no bigger than a human hair has successfully delivered a combination of optical,…
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Ultrahaptics collaborates with HARMAN to integrate mid-air haptic sensations into connected cars
Bristol, UK – 21st February 2017. Mid-air touch-free haptics company, Ultrahaptics, has announced a collaboration with HARMAN International Industries, Incorporated (NYSE: HAR), the premier connected…
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Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions
Expands use cases to foster development of innovative new video bridging applications using the latest generation processors, displays and sensors Design flexibility, unique programmability and…
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First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP
SAN JOSE, Calif., 21 Feb 2017 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its Cadence® Tensilica® Fusion F1 DSP is part of the latest…
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CUI Successfully Deploys its Software Defined Power Solutions (ICE Block) to Industry-Leading Data Center Operators
TUALATIN, Ore. —Â February 22, 2017Â —Â CUI announced today that it has successfully deployed initial test units of its Intelligent Control of Energy (“ICE”) Block technology (http://www.cui.com/sdp-infrastructure-solutions).…
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LETI TO PRESENT LATEST R&D RESULTS ON Three Alternatives to EUV and 193nm Lithography at SPIE Meeting in US
GRENOBLE, France – Feb. 22, 2017 – In keeping with its mission to develop photolithography alternatives for advanced technology nodes and offer competitive solutions adapted to specific applications,…
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Sequans Introduces Monarch SX: LTE-M/NB-IoT System-on-Chip for Integrated IoT Devices
PARIS, France – February 22, 2017 – LTE for IoT chipmaker Sequans Communications S.A. (NYSE: SQNS) today introduced Monarch SX, a highly-integrated system-on-chip that combines Sequans’ IoT optimized…
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STMicroelectronics Extends Flexibility of STM32 Ecosystem with Latest STM32F722 Nucleo board and STM32F723 Discovery kit
Geneva, February 22, 2017 – STMicroelectronics continues to enhance flexibility for developers working with high-performance STM32F722/723 microcontrollers[1]. A new-generation Discovery kit provides access to the STM32F723’s unique high-speed…