News – Page 1277 – EEJournal

Texas Instruments expands Bluetooth® low energy portfolio with more available memory, Bluetooth 5 compatibility and automotive qualification

DALLAS (Jan.18, 2017) – Delivering more available memory, Bluetooth® 5-ready hardware, automotive qualification and a new ultra-small wafer-chip-scale package (WCSP) option, Texas Instruments (TI) (NASDAQ: TXN)…

January 19, 2017

Latest best in class testing solutions to be showcased at DesignCon 2017 by HUBER+SUHNER

Herisau, 18 January 2017 – HUBER+SUHNER, leading manufacturer of components and systems for optical and electrical connectivity products, is set to unveil its best in class solutions…

January 18, 2017

KEMET Automotive and Commercial ESD-Rated Ceramic Capacitors in 0603 EIA Case Size Extend Choices for Designers

KEMET, a leading global supplier of electronic components, has introduced electrostatic discharge (ESD) rated ceramic capacitors in small 0603 EIA case size (metric 1608), providing…

January 18, 2017

Melexis Announces Chipset and Evaluation Kit for ToF 3D Vision in Challenging Environments

Tessenderlo, Belgium, 18 January 2017 – Melexis, the global microelectronics company enabling future innovation through a philosophy of inspired engineering, has announced a chipset and its evaluation kit that…

January 18, 2017

Intersil Battery Charger Extends Backup Battery Life of Automotive eCall Systems

TOKYO, Jan. 18, 2017 – Automotive World – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions today announced the ISL78693, a 3.6V single-cell battery…

January 18, 2017

Innovative Integration Announces the COPious-PXIe Embedded PXIe module with Zynq Z7045 coprocessor & HPC FMC I/O site

Camarillo, CA January 16, 2017: Innovative Integration, a Molex Company and trusted supplier of signal processing and data acquisition hardware and signal processing solutions, today…

January 18, 2017

AVX Releases New Vertical Poke-Home Connector Carefully Tooled to Compete Against Hand Soldering in 18AWG Applications

FOUNTAIN INN, S.C. (January 17, 2017) – AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released the first vertical connector…

January 17, 2017

Highly Integrated Capacitive-Digital Converter Delivers Superior Gesture Sensing and Enhanced Touch Performance to Automotive & Industrial Systems

PHOENIX, Ariz. – January 17, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new touch/proximity sensing solution that combines industry-leading…

January 17, 2017

Mont-Blanc project selects Cavium’s ThunderX2™ processor for its new ARM-based HPC platform

Les Clayes, France – Barcelona, Spain January 16 , 2017. The Mont-Blanc European project has selected Cavium’s (NASDAQ:CAVM) ThunderX2 ARM server processor to power its…

January 17, 2017

ams launches world’s first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology

Premstaetten, Austria (17 January, 2017) — ams AG (SIX: AMS), a leading provider of high performance sensor solutions and analog ICs, today launched the world’s…

January 17, 2017

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