Archives: News
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STMicroelectronics Teams with Mobile-Payment Partners to Create Turnkey, Certification-Ready Solution for Wearable Devices
ST, Giesecke & Devrient (G&D), and FitPay join forces to overcome traditional barriers to OEMs implementing payment applications on wearable devices Groundbreaking secure solution with…
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The zigbee alliance to Unveil Universal Language for the IoT from CES 2017 – Making it Possible for Smart Objects to Work Together on Any Network
Davis, Calif. – January 3, 2017 – The zigbee alliance today announced that from CES 2017 this week it will be showcasing the path to a unified Internet…
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Valencell Raises the Bar in Biometric Sensor Solutions for Hearables and Wearables
LAS VEGAS, Jan. 4, 2017 /PRNewswire/ — CES 2017 – Valencell, the leading innovator in performance biometric sensor technology, today announced the launch of two new versions of its Benchmark™ sensor systems,…
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Green Hills Software to Showcase High Assurance Platforms for Automotive Cockpit with Renesas’ R-Car
LAS VEGAS, NV — January 4, 2017 — CES 2017, North Hall booth 3132 — Green Hills Software, the worldwide leader in high assurance operating systems, today announced…
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Linear Technology Demonstrates Breakthrough Wireless Battery Management System in BMW i3 at CES
MILPITAS, CA – January 4, 2017 – Linear Technology, the leading provider of battery stack monitoring ICs for electric and hybrid/electric vehicles, is demonstrating the…
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Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for 8 Microphone Far-Field Voice Pickup Applications
MOUNTAIN VIEW, Calif., – January 03, 2017 – the leading licensor of signal processing IP for smarter, connected devices, today announced that Shenzhen Micro & Nano Institute…
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STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services
ST’s ‘Telemaco’ family combines telematics and connectivity functions in the same chip, delivering economical, scalable platform Latest-generation chips pack in hardware-accelerated cybersecurity and extra processing…
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congatec presents new COM Express modules with Gen 7 Intel® Core™ processors (codename Kaby Lake)
San Diego, CA, January 3, 2017 * * * congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services…
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Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules
Drunen (The Netherlands) and Leuven (Belgium)—January 3, 2017—Today, the world-leading research and innovation hub in nano-electronics, energy and digital technology imec (partner in EnergyVille) and…
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STMicroelectronics Peps Up Booming Social-Fitness Scene with Smart Motion Sensors for Better Accuracy, Longer Battery Life, and Faster Time to Market
ST smart MEMS sensors with on-board pedometer extend battery life of devices hosting always-on activity-tracking apps Already designed into several smartphones to enable the social…