Archives: News
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Toshiba Expands Lineup of Embedded NAND Flash Memory Products for Automotive Applications
IRVINE, Calif., Dec. 20, 2016 /PRNewswire/ — Toshiba America Electronic Components, Inc. (TAEC)* today announced the launch of JEDEC®[1] e–MMCTM Version 5.1[2]-compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 [3] requirements. The…
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element14 launches ‘Safe & Sound’ Wearables Design Challenge
London, Wednesday 21 December element14, the world’s largest electronic design community, has launched a new Design Challenge for designers and engineers called ‘Safe and Sound’. Sponsored…
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XP Power offers encapsulated 80 Watt AC-DC modules in an ultra-compact footprint
XP Power today announced the ECE80 series of 80W single output AC-DC encapsulated power supply modules with high efficiency and a low no load input…
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CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES
MOUNTAIN VIEW, Calif., – December 21, 2016 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, announced today that it will…
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ON Semiconductor Demonstrates Complete USB Type-C Solutions for Rapid Charging and High-Speed Data Transfer at CES 2017
Phoenix, Ariz.– December 20, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will be showcasing its portfolio of solutions for the effective implementation of USB Type-C applications at the 2017…
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Samtec to Present Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017
New Albany, IN: Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, will participate in the DesignCon 2017 conference…
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STMicroelectronics and Valencell Announce Collaboration on Highly Accurate and Powerful Biometric Sensor Platform for Wearables and IoT
Raleigh, N.C., Geneva, Switzerland – December 20, 2016 – Valencell, the leading innovator in performance biometric data sensor technology, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the…
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Ericsson scales new heights for power handling and thermal management with advanced bus converter
New advanced bus converter leverages Ericsson’s advanced Hybrid Regulated Ratio (HRR) topology to deliver up to 450W and 37.5A for high-power, high?performance applications PKB4413D offers…
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EMA Launches ‘Official Holiday Caption Contest’
Rochester, NY (December 12, 2016) – EMA Design Automation® (www.ema-eda.com), a full-service provider of Electronic Design Automation (EDA) solutions, has launched a ‘Holiday Caption Contest’…
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World First NB-IoT Base Station acceptance testing at CMCC, supported by Rohde & Schwarz
With growing demand for LPWA (Low Power Wide Area) services and applications as part of the Internet of Things (IoT), 3GPP has developed Narrow Band…