News – Page 1319 – EEJournal

Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT

SAN JOSE, Calif., Sept. 27, 2016 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced the expansion of its cost-optimized silicon portfolio targeting a wide range of applications including…

September 28, 2016

STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables

Geneva, September 28, 2016 – A miniaturized wireless battery-charging chipset from STMicroelectronics saves space, simplifies enclosure design and sealing, and accelerates time to market for ultra-compact sports wearables,…

September 28, 2016

Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs

CAMBRIDGE, United Kingdom, 27th September 2016 – UltraSoC today announced that Imagination Technologies (IMG.L) has licensed the full range of UltraSoC semiconductor IP and software, enabling Imagination to help customers integrate…

September 27, 2016

Adesto Introduces EcoXiP™: the Ultimate Memory Solution for Intelligent IoT Devices

SUNNYVALE, Calif., Sept. 27, 2016 (GLOBE NEWSWIRE) — Adesto Technologies (NASDAQ:IOTS), a leading provider of application-specific, ultra-low power non-volatile memory products, today introduced EcoXiP™, a new eXecute-in-Place…

September 27, 2016

Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab

September 27, 2016 09:00 AM Eastern Daylight Time FREMONT, Calif.–(BUSINESS WIRE)–Spin Transfer Technologies, Inc. (STT), a leading developer of breakthrough Orthogonal Spin Transfer Magneto-Resistive Random…

September 27, 2016

Ericsson raises the bar with high-current 780W power interface module for ATCA applications

Quarter-brick power interface module (PIM) converter targets high-power Advanced Telecom Computing Architecture (ATCA) server applications Feature-packed ultra-high-efficiency module delivers 15A output current at 82°C with…

September 27, 2016

Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability to 2 to 64 FLOPS/Cycle

SAN JOSE, Calif., September 27, 2016?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced general availability of the 12th generation Tensilica® Xtensa® base processor architecture. The Xtensa…

September 27, 2016

Archives: News

Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT

STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables

Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs

Adesto Introduces EcoXiP™: the Ultimate Memory Solution for Intelligent IoT Devices

Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab

Ericsson raises the bar with high-current 780W power interface module for ATCA applications

Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability to 2 to 64 FLOPS/Cycle

ON Semiconductor Introduces Next Generation Fan Motor Drivers to Simplify and Accelerate Appliance Design

Imperas Expands University Partners Program

Faster, Easier Simplicity Studio Software from Silicon Labs Sets the Pace in Wireless IoT Design