News – Page 1320 – EEJournal

Ampleon launch ultra compact two-stage Doherty amplifier for 4.5 G / LTE Advanced Pro applications

Nijmegen, The Netherlands – Ampleon today announced a new family of integrated Doherty power amplifier devices aimed at LTE Advanced Pro / 4.5G massive-MIMO base…

September 27, 2016

Renesas Electronics Europe Launches EtherCAT® Dedicated Communication SoC for Remote I/O Slave Applications in Industrial Automation

Düsseldorf, September 27, 2016 – Renesas Electronics Europe today announced a low-cost EtherCAT® dedicated communication system-on-chip (SoC) that will help boost production efficiency in factories. The EC-1 SoC is…

September 27, 2016

Pentek Introduces Evolutionary Jade Architecture with Navigator Design Suite Software Tools

Jade architecture with Xilinx Kintex Ultrascale FPGA offers price, power and processing performance advantages Navigator Design Suite compatible with Xilinx’s Plug-and-Play Vivado IP Integrator expedites…

September 26, 2016

Riverwood Solutions Continues Expansion in the MEMS and Sensor Ecosystem:

Following continued growth, Riverwood Solutions is taking steps to broaden its presence in the emerging technology ecosystems. As one of several broader initiatives Riverwood Solutions…

September 26, 2016

Renesas Electronics Delivers Contactless Wireless Charging Solution for Healthcare and Wearable Devices

Düsseldorf, September 26, 2016 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced a contactless wireless charging solution for low-power applications, such as hearing aids…

September 26, 2016

Sophisticated Power Management IC Pushes Performance Envelope & Enables More Effective Energy Harvesting

26th September 2016, Liege, Belgium: Following its arrival on the power semiconductor scene earlier this year, e-peas today announces commercial availability of its first IC. The AEM10940 utilizes the company’s unique proprietary…

September 26, 2016

Mentor Graphics SystemVision Improves Siemens Building Technologies’ PCB Design Flow Worldwide

WILSONVILLE, Ore., September 26, 2016 – Mentor Graphics Corporation (NASDAQ: MENT) today announced that Siemens Building Technologies has deployed Mentor’s SystemVision® product to Siemens printed circuit board…

September 26, 2016

TSMC and Synopsys Collaboration Delivers Innovative Technologies for the High Performance Compute (HPC) Platform

MOUNTAIN VIEW, Calif., Sept. 22, 2016 /PRNewswire/ — Highlights: Innovations include multiple new implementation technologies including via pillar and clock tree optimizations in IC Compiler II Both…

September 23, 2016

Pasternack Introduces New Lines of RF and Microwave Waveguide Directional Couplers

Irvine, CA – Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, introduces a brand new family ofwaveguide directional couplers displaying highly…

September 23, 2016

Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms

SAN JOSE, Calif., 22 Sep 2016 Highlights: Cadence digital, signoff and custom/analog tools certified and PDK-enabled for latest 7nm DRM and SPICE TSMC and Cadence…

September 23, 2016

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