News – Page 1650 – EEJournal

Hitachi Tapes Out 28nm Design with Cadence Tempus Timing Signoff Solution, Reducing Timing Closure by One Month

Hitachi chooses Tempus Timing Signoff Solution to tape out their latest giga-scale design at the 28nm process node. Hitachi also used Tempus physically aware Timing…

July 7, 2014

Digitizer Cards Get FPGA-Based Signal Averaging Capabilities

Grosshansdorf, Germany — Using the latest in FPGA technology Spectrum has created new firmware packages that allow its high-speed M4i series digitizer cards to perform on-board signal…

July 7, 2014

Laird Introduces Industry’s Smallest High-Performance Low Profile UHF Vertical Antenna

July 07, 2014– Laird, a global technology company, has launched the patent pending Ultra Phantom low profile vertical antenna product line. The Ultra Phantom is the…

July 7, 2014

PowerSquare Unveils Adaptive Position-Free System for the Industry and Consumers

Bangalore, India, July 5, 2014 — PowerSquare, Inc., a fast-growing startup in the wireless power industry, today announced the launch of its patent-pending Adaptive Position-Free (APF)…

July 7, 2014

FinScale’s Quantum FinFET Aims to Revive Moore’s Law

LIVERMORE, Calif., July 01, 2014 – FinScale Incorporated, the semiconductor device and process innovation company, today announced immediate availability of its qFinFET™ technology, a next…

July 4, 2014

Integrated Wireless Controller from LPRS Provides On-Board User Application Memory

LPRS, Europe’s leading manufacturer of short-range wireless devices, now offers Internet of Things (IoT) and other wireless control or communication system builders with a system-on-chip…

July 3, 2014

Thunderstruck: the AC/DC feud between Tesla and Edison

WACO, Texas (July 3, 2014) – One studied alternating current (AC), the other, direct current (DC). And yet, the world would not be where it…

July 3, 2014

Board test and debug security via JTAG, IJTAG is explored in new eBook

Richardson, TX (July 1, 2014) ? Visibility into the operations and data stored on circuit boards and in semiconductors is the goal of test and…

July 3, 2014

Nordic flagship Bluetooth Smart protocol stack enables sophisticated Bluetooth Smart wearable hub networks with wireless sensors that don’t need smartphones

Oslo, Norway – July 3, 2014 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the launch of its most advanced, feature-rich Bluetooth® Smart (formerly known…

July 3, 2014

4DSP Delivers Complete Data Acquisition, Signal Processing and Storage Solution in the XMC Form Factor

Austin, TX – 4DSP’s new FM788 is a FPGA-based COTS card designed to deliver unparalleled performance for a variety of applications, including beamforming, direction finding,…

July 3, 2014

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