Archives: News
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LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor
SAN JOSE, Calif., USA, and STAINES UPON THAMES, UK, 24 June 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design…
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Molex Backplane Pin Map Configurator Makes Designing Custom Products Easy
LISLE, IL – June 24, 2014 – Molex Incorporated recently launched a new online tool for backplane product design. TheBackplane Pin Map Configurator guides users through a series of…
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Synapse Design tapes out 33 SOCs in 12 months
San Jose, Calif. – June 25, 2014 – Synapse Design today announced that, together with its top tier semiconductor and systems customers, the Company has…
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Agilent Technologies Introduces ADS DDR4 Compliance Test Bench for Solving the Simulation-Measurement Correlation Challenge
SANTA CLARA, Calif., June 30, 2014 – Agilent Technologies Inc. (NYSE: A) today introduced Advanced Design System DDR4 Compliance Test Bench, which enables a complete workflow for DDR4…
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Zuken reduces manufacturing costs with latest E³.series release
1 July 2014 – Munich, Germany and Westford, MA, USA – Zuken announces manufacturing cost reductions through enhanced electrical design. The latest version of E³.series – Zuken’s industry-leading electrical and fluid…
