Archives: News
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eSilicon adds GDSII handoff to suite of online SoC automation tools
SAN JOSE, Calif. — May 23, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the expansion of its…
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Sabic Collaborates with Cima NanoTech on Breakthrough Technology: Industry-First Transparent Conductive Polycarbonate Film
With smart materials being one of the fastest growing areas of materials technology, SABIC and Cima NanoTech have announced the joint development of a plastics…
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Synopsys and TSMC Collaborate to Validate DesignWare IP in TSMC 16-nm FinFET Process
MOUNTAIN VIEW, Calif., May 27, 2014 /PRNewswire/ — Highlights: Validated IP in TSMC 16-nm FinFET process accelerates 16-nm FinFET Plus (16FF+) IP development and reduces SoC integration…
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Synopsys Unveils Industry’s First Complete PCI Express 4.0 IP Solution
MOUNTAIN VIEW, Calif., May 22, 2014 /PRNewswire/ — Highlights: Industry’s first complete PCI Express® 4.0 IP solution, supporting the latest PCI Express 4.0 standard, will be featured…
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KLA-Tencor Announces New Teronâ„¢ SL650 Reticle Inspection System
MILPITAS, Calif., May 20, 2014 /PRNewswire/ — Today, KLA-Tencor Corporation (NASDAQ: KLAC) announced the Teronâ„¢ SL650, a new reticle quality control solution for IC fabs that supports 20nm design…
