Archives: News
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Soitec and Simgui announce major partnership to produce 200-mm SOI wafers in China for RF and power semiconductor markets
Bernin (Grenoble), France and Shanghai, China, May 26 , 2014 — Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and…
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Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning
SAN JOSE, Calif., May 21, 2014—Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a new integrated solution to significantly cut…
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Pulsic Introduces First Complete Automated Layout System for Transistor-Level Analog and Custom-Digital Design: Animate
SAN JOSE, CA – May 21, 2014 — Existing approaches to automating analog and custom digital integrated circuit (IC) designs have attempted to improve on portions…