News – Page 1824 – EEJournal

Feature-rich FPD-Link III automotive chipset delivers HDCP video and audio to LCD touchscreens

DALLAS (July 2, 2013) – Texas Instruments (TI) (NASDAQ: TXN) expanded its FPD-Link III automotive-grade SerDes family today with the industry’s most feature-rich chipset. The…

July 2, 2013

Green Hills Software Announces AdaMULTI Support for ARM-based Processors

SANTA BARBARA, CA — July 2, 2013 — Green Hills Software, the largest independent vendor of embedded software solutions, has announced the availability of a complete integrated…

July 2, 2013

Imec solves metallization issues in advanced interconnects for the sub-1X technology node

San Francisco (USA) – July 2, 2013 – Imec has developed a Manganese (Mn)-based self-formed barrier (SFB) process that significantly improves Resistance Capacitance (RC) performance, via resistance…

July 2, 2013

New hardware design protects data in the cloud

CAMBRIDGE, Mass- Cloud computing — outsourcing computational tasks over the Internet — could give home-computer users unprecedented processing power and let small companies launch sophisticated…

July 2, 2013

AdaCore Brings Ada to Wind River Linux

STUTTGART, NEW YORK and PARIS, July 2, 2013 – Embedded Konferenz – AdaCore today announced the availability of the GNAT Pro Ada development environment on the Wind River Linux platform. This…

July 2, 2013

Microsemi Expands its Industry Leading Radiation-hardened Portfolio with Linear Regulators for Space, Commercial Aviation and Defense Applications

ALISO VIEJO, Calif.— July 2, 2013—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today added two new…

July 2, 2013

Two-Dimensional Atomically-Flat Transistors Show Promise for Next Generation Green Electronics

(Santa Barbara, Calif.) – Researchers at UC Santa Barbara, in collaboration with University of Notre Dame, have recently demonstrated the highest reported drive current on…

July 1, 2013

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international…

July 1, 2013

IAR Embedded Workbench for ARM gains analysis tools integration and power optimization possibilities for all ARM cores

Uppsala, Sweden – June 27, 2013 – Today, IAR Systems® launches a new version of its embedded development toolchain IAR Embedded Workbench® for ARM®. Version…

July 1, 2013

Semtech’s New Long-Range RFIC Platform Will Drive Internet of Things (IOT) and Machine-to-Machine (M2M) Deployments

CAMARILLO, Calif., June 27, 2013 — Semtech Corporation. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today introduced theSX1272 the first product in a…

July 1, 2013

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