Archives: News
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KLA-Tencor Announces New Additions to its Defect Inspection and Review Portfolio
MILPITAS, Calif., July 8, 2013—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced the new 2910 Series optical wafer defect inspection platform withNanoPointTM technology and the new eDRTM-7100 electron-beam wafer defect review…
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ProTek Devices Intros its First Family of Overcurrent Electronics Chip Fuses
TEMPE, Ariz. – July 8, 2013 – ProTek Devices today introduced a family of overcurrent electronics chip fuses that add to the company’s extensive availability of overvoltage…
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Mouser signs global distribution agreement with Plessey
Plymouth, ENGLAND – 8 July 2013 – Mouser Electronics, Inc.has signed a global distribution agreement for Plessey’s complete range of innovative products including Plessey’s award winning products such…
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TSMC Expands Collaboration with Cadence on Virtuoso Custom Design Platform
HIGHLIGHTS: TSMC to create and deliver native SKILL®-based PDKs in support of the Cadence® Virtuoso® platform to provide customers with the best user experience and…
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Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging
SEMICON WEST, San Francisco (USA) – July 8, 2013 – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among…
