Archives: News
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Xilinx and TSMC Team to Enable Fastest Time-to-Market and Highest Performance FPGAs on TSMC’s 16-nanometer FinFET
SAN JOSE, Calif. and HSINCHU, Taiwan – May 29, 2013 – Xilinx Inc. (NASDAQ: XLNX) and TSMC (TWSE: 2330, NYSE: TSM) announced that they are teaming…
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ANSYS Subsidiary’s Customers Present Methodologies for Ultra-low-power, High-performance, Reliable and Cost-optimized Designs for Mobile, Custom Analog, and Automotive Applications
ANSYS subsidiary Apache Design, Inc. will exhibit its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for…
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CaetanoBus Streamlines its Electrical Design Processes Using Capital Software from Mentor Graphics
WILSONVILLE, Ore., May 30, 2013—Mentor Graphics Corp. (NASDAQ: MENT) and CaetanoBus today announced successful application of the company’s Capital® software suite to the development of CaetanoBus’…
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CORMORAN Project Exploring Ways to Improve Cooperation In and Between Wireless Body Area Networks
GRENOBLE, France – May 30, 2013 – CEA-Leti today announced it is coordinating the multi-partner CORMORAN project focusing on new forms of cooperation in and…
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Berkeley Design Automation Announces Analog FastSPICE™ Mega
SANTA CLARA, CA, — May 29, 2013—Berkeley Design Automation, Inc., provider of nanometer circuit verification, today announced the availability of the Analog FastSPICE Mega (AFS…
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Synopsys Introduces Starter Kit for DesignWare ARC EM Processors
MOUNTAIN VIEW, Calif., May 29, 2013 /PRNewswire/ — Highlights: Starter kit enables “out-of-the box” software development, debugging and system analysis for ARC EM Family of embedded cores…