Archives: News
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Synopsys Collaboration with ACE Associated Compiler Experts Aids Compiler Technology for Processor Designer
In the world of application-specific processor design, architects require highly automated software development tools to efficiently architect their design. To aid architects in their design…
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Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon West 2013
Regensburg, Germany, 29May 2013 — Amicra Microtechnologies GmbH, a worldwide leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions, comes to this year’s Semicon West…
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Mentor Graphics and TSMC Collaborate to Improve and Expand 20nm IC Physical Verification Offering
WILSONVILLE, Ore., May 28, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.…
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Coventor’s SEMulator3D 2013 Addresses New Requirements of 3D Fab Era With Process Modeling Accuracy And Automation Breakthroughs
CARY, North Carolina – May 28, 2013 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced immediate availability…
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ULIS launches thermal sensor array product line, within scope of European MIRTIC project
ULIS will demonstrate Micro80P, the first in a new generation of thermal sensor arrays, at Sensor & Test in Nuremburg, Germany, May 14 – 16,…
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Next Generation PCB Library Expert Released
Des Plaines, IL – PCB Libraries just release the next generation of the Footprint Expert, now called the “PCB Library Expert” version 2013 – an…
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Concept Engineering Adds SPEF Parasitic Netlist Interface to SpiceVision® PRO and StarVision® PRO
Freiburg, Germany—May 28, 2013 – Concept Engineering has added a new SPEF (standard parasitic exchange format) interface to their widely-installed debugging tools, SpiceVision® PRO and StarVision® PRO. SpiceVision PRO takes…
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First precise MEMS output measurement technique unveiled
Tuesday 14th May, Washington DC – The commercial application of MEMS, or micro-electro-mechanical systems, will receive a major boost today following the presentation of a…