News – Page 1846 – EEJournal

Lattice’s Latest Design Software Enables Designers to Derive Big Benefits from Tiny FPGAs

HILLSBORO, OR – May 28, 2013 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced Lattice Diamond® v2.2 software, its flagship FPGA logic design software, and iCEcube2™ (v2013-03) software, the…

May 28, 2013

Avnet Electronics Marketing Releases Production-Grade ZedBoard

PHOENIX—May 28, 2013 — Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT), is now shipping the production-grade ZedBoard, the industry’s first development kit to offer production…

May 28, 2013

New power management IC from ams helps reduce thermal stress on processors in phones and tablets

Unterpremstaetten, Austria (28 May, 2013) – ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced the AS3721, a…

May 28, 2013

Wind River Advances Open Source Innovation for Automotive with iOS Connectivity for Linux IVI Systems

AUTOMOTIVE LINUX SUMMIT, TOKYO, Japan – May 28, 2013 – Wind River®, a world leader in embedded and mobile software, has introduced Wind River Connectivity Solution Accelerator for Linux,…

May 28, 2013

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro- and Nano-Electronics Production

SEMICON SINGAPORE, May 7, 2013 -EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced…

May 27, 2013

New TESEQ CBA 400M-260 Amplifier operates from 10 kHz to 400 MHz and has a rated power of 260 watts

Teseq, a leading developer and provider of instrumentation and systems for EMC emission and immunity testing, has expanded its broadband amplifier line to include a…

May 27, 2013

Quantenna Announces Availiability of The World’s Fastest Wi-Fi Chipset

FREMONT, Calif. – May 22, 2013 – Quantenna Communications, Inc., the leader in ultra-reliable Wi-Fi networking for whole-home entertainment, has redefined wireless performance and quality once again with…

May 27, 2013

S2C Debuts Low-Cost Rapid SoC Prototyping Hardware – K7 TAI Logic Modules

San Jose, CA – May 28, 2013 – S2C Inc., a leading rapid SoC/ASIC prototyping solutions provider, announced today a new family of its fifth-generation product, the…

May 27, 2013

Oski Technology to Showcase its Industry-Proven Formal Sign-off Methodology at DAC

MOUNTAIN VIEW, CALIF. –– May 23, 2013 –– (reminder June 3 at 8:45am ET) WHO: Oski Technology (www.oskitech.com), the world’s only dedicated formal verification services provider WHAT: Will demonstrate Oski Formal Sign-off…

May 27, 2013

Docea Power to present unique solutions for modelling and simulation of dynamic thermal management strategies at DAC

Grenoble, France and San Jose, CA – May 23 , 2013 – Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, will…

May 27, 2013

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