News – Page 1868 – EEJournal

Flexras Technologies Enhances Wasga Compiler Partitioning Tool, Adds Support for Virtex-7 FPGA-based FPGA Platforms

Paris, France – April 16, 2013 – Flexras Technologies, the provider of high performance partitioning software, today announced the release 3.2 of itsWasgaTMCompiler Design Suite for FPGA-based prototyping. …

April 16, 2013

Study Says 20nm SRAM Design Could Suffer from the Interplay Between Statistical Variability and Reliability

GLASGOW, Scotland, April 16, 2013 /PRNewswire/ — Gold Standard Simulations (GSS) revealed today that the interplay between the effects of statistical reliability and variability could…

April 16, 2013

Lattice Introduces Image Sensor Extender Reference Design

HILLSBORO, OR – April 11, 2013 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the SensorExtenderTM reference design that offers a low-cost approach to remotely locate image sensors up to eight…

April 15, 2013

Mouser Announces Global Distribution of Terasic Technologies’ Design Solutions for Altera FPGAs

April 15, 2013 – Mouser Electronics, Inc. today announced a new global distribution agreement with Terasic Technologies, a world innovator in FPGA design solutions. The Terasic product…

April 15, 2013

Registration Opens for Microchip’s 17th Annual Worldwide MASTERs Conference; Premiere Technical Training Event for Embedded-Control Engineers

CHANDLER, Ariz., April 15, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced it is accepting registrations…

April 15, 2013

Laird Technologies to Demonstrate Thermobility™ Wireless Power Generators at Energy Harvesting & Storage Europe Thermobility™ Series Provides Turn-key Solution for Design Engineers

St. Louis, Missouri, USA – April 9, 2013 – Laird Technologies, Inc., a leading global technology company, announced today that it will demonstrate its Thermobility™ Wireless…

April 15, 2013

ADLINK Technology in Intelligent Systems Zone at Design West

SAN JOSE, CA – April 11, 2013 – ADLINK Technology, a leading provider of Application Ready Intelligent Platforms (ARIP), invites attendees to visit Booth 1131 in the…

April 15, 2013

RFEL launches the HALO low-power, real-time, video processing system for enhancing images for defence, security and counter terrorism surveillance

Newport, Isle of Wight, UK – 15 April 2013 – RFEL, who specialises in high performance, electronic video and signal processing solutions, will be launching HALO™, the…

April 15, 2013

LG Adopts In-Design Physical Verification with IC Compiler and IC Validator after Multiple Successful Tapeouts

Highlights Synopsys’ In-Design physical verification with IC Validator and IC Compiler place-and-route solution accelerates LG Electronics’ manufacturing closure by two weeks Multiple successful tapeouts using…

April 15, 2013

Meggitt Sensing Systems introduces high-temperature triaxial, piezoelectric charge output accelerometer

April 1, 2013, San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has announced the global market introduction of the Endevco®…

April 12, 2013

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