News – Page 1870 – EEJournal

Altera Demonstrates Industry’s First QPI 1.1 FPGA Home Agent for Enhanced Server Capabilities

San Jose, Calif., April 10, 2013—Altera Corporation (NASDAQ: ALTR) today announced the industry’s first demonstration of an FPGA Home Agent enabled by the Intel QuickPath Interconnect…

April 10, 2013

Microsemi and Virtual Extension Team to Enable Lowest Power Sub-GHz Mesh Network for Coin Cell Powered and Energy Harvest Applications

ALISO VIEJO, Calif.—April 10, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Virtual Extension, a…

April 10, 2013

New Freescale Freedom Development Platform for the Kinetis K20 MCU available globally from Premier Farnell

April 10, 2013 CHICAGO – Premier Farnell is pleased to announce the global availability of Freescale Semiconductor’s newest Freedom Development Platform for evaluating Kinetis K20 MCUs at element14. The…

April 10, 2013

ADLINK aTCA-9300 ATCA® Processor Blade Delivers Telecom Grade Performance with Optimum Cost Efficiency

SAN JOSE, CA – April 9, 2013 – ADLINK Technology, a renowned provider of robust telecom-grade processor blades, rolls out the newest member of its AdvancedTCA® blade…

April 9, 2013

New Miniaturization Record by STMicroelectronics Makes More Room for Mobile Functionality

Geneva, April 8, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the world’s largest supplier…

April 9, 2013

Bluetooth low energy temperature sensor platform brings low cost smart monitoring to consumers and commercial users using a smartphone

Oslo, Norway – April 9, 2013 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Hong Kong-based National Electronics…

April 9, 2013

Plessey is first to release GaN on silicon LEDs

Plymouth, ENGLAND – 8th April 2013 – Plessey announced that samples of its Gallium Nitride (GaN) on silicon LED products (p/n PLW111010) are available today. These entry…

April 9, 2013

TI introduces lowest-power AISG modem transceiver

DALLAS (April 9, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a fully-integrated, on-off keying modem transceiver that is compliant with the Antenna…

April 9, 2013

Silex Microsystems and BroadPak Bring 2.5D IC Packaging Capabilities to the Mainstream Market through Low-Cost, High-Performance Silicon Interposers

JÄRFÄLLA, Sweden and San Jose, Calif., April 8, 2013 – Silex Microsystems, the world’s largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon…

April 9, 2013

IAR Embedded Workbench certified for functional safety development

Uppsala, Sweden—April 9, 2013— IAR Systems®, the world’s leading supplier of development tools for embedded systems, today announced that the build chain of the tool…

April 9, 2013

Archives: News