News – Page 1896 – EEJournal

Achronix Now Shipping 22nm Speedster22i FPGAs to Customers

Santa Clara, Calif., February 20, 2013 – Achronix Semiconductor Corporation announced today that it has begun shipping the industry-leading Speedster®22i HD1000 FPGA to customers. Built…

February 20, 2013

Agilent Technologies Launches Versatile Benchtop Boundary Scan Analyzer for Electronic Test

SANTA CLARA, Calif., Feb. 19, 2013 – Agilent Technologies Inc. (NYSE: A) today announced the launch of the Agilent x1149 boundary scan analyzer. Boundary scan has become an indispensable technology…

February 20, 2013

Microchip and Digilent® Add Arduino™ Compatible chipKIT™ uC32™ Development Platform and Wi-Fi® Shield for 32-bit PIC® Microcontrollers

CHANDLER, Ariz., Feb. 20, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Digilent®, Inc., today announced the jointly…

February 20, 2013

Reflex CES Demonstrates SoC FPGA-based System-on-Module at Embedded World 2013; Highlights Prototyping Platform, Recorders, Customizable Rugged Systems

Who: At Embedded World 2013, Reflex CES, a provider of custom embedded and complex systems, will highlight its System-on-Module (SOM) design expertise with a video, and demonstrate its new FPP25 FPGA prototyping…

February 20, 2013

New Battery “Fuel Gauge” IC from STMicroelectronics Gives Reliable Runtimes for Mobile Users

Geneva, February 14, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader supplying customers across the spectrum of electronics applications and a leading manufacturer of standard…

February 20, 2013

ADLINK Launches Latest Smart Panels, SP-7W61 and SP-1061

SAN JOSE, CA – February 20, 2013 – ADLINK Technology, Inc., a leading manufacturer of industrial computing products, announces the launch of our latest Smart Panels, SP-7W61…

February 20, 2013

Imec demonstrates low power beamforming transceiver chipset for 60GHz multi-Gbit wireless communication

San Francisco (USA) – February 19, 2013 – Imec, in collaboration with Panasonic Corporation (Japan), has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60GHz radio transceiver chipset with low…

February 20, 2013

CEVA Introduces MUST™ Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework

MOUNTAIN VIEW, Calif., Feb. 19, 2013 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today…

February 20, 2013

Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications

SAN JOSE, Calif., Feb. 20, 2013 – Xilinx, Inc. (NASDAQ: XLNX) announced today the availability of its new Gigabit class 1024QAM point-to-point (PtP) microwave modem IP…

February 20, 2013

Silicon Labs and Sigfox Collaborate To Unleash The Potential of The Internet Of Things

AUSTIN, Texas, and TOULOUSE, France – Feb. 20, 2013 – Silicon Labs (NASDAQ:SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, and SIGFOX, the first operator…

February 20, 2013

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